Fully Automatic High Precision Eutectic Die Bonding Machine
The MicroStar Series is a series of leading multifunctional Die Attach Equipments with high efficiency (12-50s/pcs) and high precision (±0.5~±3μm) .
AOI Inspection Machine
The CesiStar Series AOI provides high performance, fully automated optical inspection of packaged integrated circuit(IC) components.
BECOMING A LEADER IN CORE VALUE
Suzhou Bozhon Semiconductor Co., Ltd. is a wholly-owned subsidiary of Bozhon Precision Technology Co., Ltd. (stock code: 688097), relying on Bozhon Precision Technology's more than 20 years of technological accumulation and focusing on semiconductors.
30+
Patent Certification
60%
Ratio of R&D personnel
10+
Global regional layout
4,0000
m2
Production base area
Go tech! Go core!
We are committed to developing highprecision chip mounting, AOI optical detection, multi chip packaging and crystal solidification, etc Series devices. The product is widely used in photoelectron, laser, sensor, power semiconductors, microwave radio frequency, semiconductor inspection and other industries.
News
-
Corporate News2024-09-20CIOE Interview with Bozhon Semiconductor: Modular Design Enables Flexible Patch to Meet the Diverse Needs of Optical Module Customers
-
Corporate News2024-09-20Interview with Bozhon Semiconductor: Leading 400G~1.6T Optical Module Packaging Technology Innovation
-
Corporate News2023-11-17Optical Union Future | Bozhon Semiconductor Attends the World Optical Communication Conference
