Committed to becoming a leader of precision mounting and inspection equipment
Fully Automatic High Precision Eutectic Die Bonding Machine
The MicroStar Series is a series of leading multifunctional Die Attach Equipments with high efficiency (12-50s/pcs) and high precision (±0.5~±3μm) .
AOI Inspection Machine
The CesiStar Series AOI provides high performance, fully automated optical inspection of packaged integrated circuit(IC) components.
Free Proofing
BECOMING A LEADER IN CORE VALUE

Suzhou Bozhon Semiconductor Co., Ltd. is a wholly-owned subsidiary of Bozhon Precision Technology Co., Ltd. (stock code: 688097), relying on Bozhon Precision Technology's more than 20 years of technological accumulation and focusing on semiconductors. 

20+
More than 20 years of technical precipitation
60%
Ratio of R&D personnel
10+
Global regional layout
4,0000
M2
Production base area
Go tech! Go core!

We are committed to developing highprecision chip mounting, AOI optical detection, multi chip packaging and crystal solidification, etc Series devices. The product is widely used in photoelectron, laser, sensor, power semiconductors, microwave radio frequency, semiconductor inspection and other industries.