Sensor
Sensor
With the rapid rise of new applications such as 5G communications, new energy, and aerospace, compound semiconductors are increasingly becoming key strategic field materials. Indium phosphide (InP), as an advanced semiconductor material, is gradually expanding from the traditional data communication market to the wider C-end consumer market. This expansion is mainly due to the unique physical properties of indium phosphide, such as high saturated electron drift speed, excellent thermal conductivity, efficient photoelectric conversion capability and wide band gap. These properties give indium phosphide a significant advantage in the manufacture of advanced sensors for high-performance, high-efficiency electronic devices.
The Challenge
Indium phosphide substrates are also ideal for use in the manufacture of sensors in wearable devices. These sensors can monitor vital signs such as heart rate, blood pressure, blood oxygen levels, and potentially even more nuanced health indicators such as blood sugar levels. It is predicted that with the continuous progress of technology and the continuous expansion of the market, by 2027, the market size of indium phosphide in downstream applications will reach about 5.6 billion US dollars.
Our Recommendation
The sensor can feel the specified being measured and convert it into an available output signal according to a certain law to meet the requirements of information transmission, processing, storage, display, recording and control, and is usually composed of sensitive elements and conversion elements. We recommend using MicroStar EF9621 automatic high precision eutectic die bonding machine to process the sensor package.
Application Results
These configuration options make the MicroStar Series EF9621 fully automatic high-precision eutectic mounter a complete assembly solution.
Design of high precision pick and fit system
The high precision gantry double drive linear motor platform is adopted to meet the high response and high precision requirements of XY motion, and the dynamic response performance and stability of the motion platform are continuously optimized by co
High production efficiency, high patch yield
High-precision ZR module, tool change module, down vision module and process observation camera module not only meet the requirements of high-precision force control fitting, but also realize online dynamic tool change and real-time process monitoring, combined with high-precision vision system to ensure the accuracy of the fitting system.
High efficiency eutectic platform design
At the same time, it has the function of nitrogen protection and nitrogen rapid cooling, which can achieve rapid rising and cooling, the highest heating rate is 80℃/s, and the cooling time is up to 5s from 340℃ to 200℃.
Flexible feeding options
We can configure the system according to your feeding requirements: Waffle boxes, Gel-Pak™, wafers, rolls and custom trays.
High precision vision system design
Using dual vision system design, greatly reduce the impact of external factors on the vision system, can automatically switch, taking into account different sizes of materials.
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