On 26th December,   2024 MEI Award  Ceremony was successfully held in Nanjing, Suzhou Bozhon Semiconductor (hereinafter referred to as ‘Bozhon Semiconductor’) MicroStar series of eutectic submicron die bonder was awarded the ‘2024 MEI Award among 8192 products with its excellent design innovation, technological breakthroughs, market value, and foresight. The company won the ‘ 2024 MEI Award ’.

△ Bozhon Semiconductor marketing manager as a representative on the stage to receive the award (first from the left)

The MEI Award is regarded as the ‘wind vane’ of China's industrial design industry, and is organised by Made in China (MIC International), aiming at recognising Chinese-made products with outstanding performance in design, innovation and quality, with the aim of ‘discovering the beauty of manufacturing and showcasing quality-made products’. With the aim of ‘discovering the beauty of manufacturing and showcasing quality products’, the award helps Chinese products establish international brands and win bargaining power in the market. The final evaluation is led by Professor Liu Guanzhong, the ‘Father of Chinese Industrial Design’, and a professional jury consisting of experts and professors from China Industrial Design Association, Guangdong Industrial Design Association, Fujian Industrial Design Association, SGS, etc. The jury selects the products in terms of product quality, innovation value, green environmental protection, human-computer interaction, safety compliance, aesthetic effect and other dimensions.

MicroStar series eutectic die bonder is a high-precision and high-efficiency multifunctional chip placement equipment. The placement accuracy is ±0.5~3μm, and the efficiency of eutectic placement can reach 12~50s/pcs. It has the functions of eutectic, glue dipping and Flip Chip placement, which can meet the demand of multi-chip placement. The modular design concept makes it highly flexible manufacturing capability, equipped with intelligent calibration and data management system, so that it has the ability of process traceability and management.


At present, the whole series of MicroStar products in the field of optical modules, lasers, microwave radio frequency and other areas have accumulated a wealth of customer scenarios, in many countries around the world with equipment delivery experience. Chip attach is a key process in the packaging process, and there are many different packaging processes for optoelectronic devices in different market segments. In the face of the differentiated needs of different customers' chip packaging, it is difficult for traditional placement equipment to meet their individual needs, which requires equipment manufacturers to ensure high precision, in-depth understanding of the process requirements, combined with the design of the packaging process and the characteristics of different material chips for flexible customisation, to meet the requirements of exploring the process of validation and development and mass production.

MicroStar series contains several models, each with unique design and features. Among them, EH8621 eutectic die bonder has been iteratively upgraded to the third generation new model of EH8621-PLUS, which upholds the high precision and high reliability while maximally enhancing the multi-functional compatibility of the equipment, supporting a variety of placement processes, such as COC/COS/GOLD BOX/Flip Chip, etc. The machine is also upgraded with programmable pulse heating algorithm to precisely control the temperature during the eutectic process, achieving 0 overshoot of the surface temperature. It also upgrades the programmable pulse heating algorithm to accurately control the temperature during the eutectic process and realises zero overshoot in surface temperature. In addition, the mechanical structure retains the original model of dual-station while increasing the streamline design, which can be seamlessly connected to the AGV automatic loading and unloading, further improving the production efficiency, and realising the interconnection of the material production line's data status.

In the future, Bozhon Semiconductor will continue to focus on market segments, close to the customer process and service requirements, and continue to strengthen innovation and R & D to enhance product innovation and brand competitiveness, and is committed to providing customers around the world with higher-quality products and equipment, to promote the sustainable development of the industry.