- 
			7.5μm3D rep/acc
- 
			3x3mm-50x50mmDevice Size
- 
			BGA/QFN/QFPChip packaging type
						Application Scenarios
					
				
			Product Parameters
					 
 
								High precision 3D measurement
The accuracy and repeatability up to 7.5um
	
	
	
	
 
								
High performance and easy to operate software
Create a new recipe<1H
 
									 
									 
								
Fast product changeover time
< 20 min
	
 
								
	
	 
		Intelligent defect classification function
	 
		Intelligent defect classification algorithm engine
	 
		
	
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