AOI Inspection Machine

The CesiStar Series AOI provides high performance, fully automated optical inspection of packaged integrated circuit(IC) components. It leverages high sensitivity with 2D/3D inspection and measurements to determine final package quality for a wide range of device types and sizes.

High precision
High efficiency
High flexibility
Easy to expand

CesiStar TV6-15T
The CesiStar TV6-15T mainly applies QFN,QFP,FCBGA and other products, we provide customers with efficient and high-quality chip six-sides optical testing with ultra-high detection accuracy.
Product Parameters
  • 7.5μm
    3D rep/acc
  • 3x3mm-50x50mm
    Device Size
  • BGA/QFN/QFP
    Chip packaging type

High precision 3D measurement

The accuracy and repeatability up to 7.5um





High performance and easy to operate software

Create a new recipe<1H

Fast product changeover time

< 20 min


Intelligent defect classification function

Intelligent defect classification algorithm engine


Free Proofing