0512-63414949-80512
Service hotline
Exhibition News | Bozhon Semiconductor Meets You at the Asia Optoelectronics Expo
2024-02-23
2024，2/21, Fiber Optics Online News: The Asia Optoelectronics Expo (APE 2024) will be held from March 6-8, 2024 at the Sands Convention and Exhibition Center in Singapore, focusing on the latest cutting-edge innovative technologies and emerging application markets in the Asian optoelectronics industry, promoting deep exchanges and commercial cooperation between the upstream and downstream of the optoelectronics industry. Suzhou Bozhong Semiconductor Co., Ltd. (hereinafter referred to as "Bozhon Semiconductor"), with the theme of "Riding the Wind of AI, Supporting Optoelectronic Innovation", will showcase packaging solutions in four major fields: portable optical modules, LiDAR, sensors, and IGBT. We sincerely invite you to visit, exchange, and negotiate business at the EE-21 booth！
Exhibition Information
Time: 3.6-3.8
Location: Sands Convention and Exhibition Centre, Singapore
Booth number: EE-21
Bozhon Semiconductor Equipment
MicroStar series fully automatic high-precision eutectic machine
The MicroStar series eutectic machine is a high-precision and high-efficiency multifunctional chip mounting equipment. The efficiency of eutectic die bonder can reach 15-35s/pcs, and the die bonder accuracy is ± 0.5~± 3 μ M. Equipped with eutectic die bonder, dipping die bonder, and Flip Chip die bonderfunctions, it can meet the needs of multi chip mounting. The modular design concept endows it with high flexibility manufacturing capabilities, equipped with intelligent calibration and data management systems, enabling it to have the ability to trace and manage processes.
Application areas: optical modules, LiDAR, power semiconductors, microwave RF, infrared lasers, etc
MicroStar series EH9721 eutectic die bonding machine
The MicroStar series EH9721 eutectic die bonder machine adopts a gantry structure design, which can ensure high precision in structural assembly to the greatest extent, improve equipment stability and high positioning accuracy. It also has functions of eutectic die bonder, dipping die bonder, Flip chip die bonder, and is applied to various packaging processes such as COC and COS. It is dynamically and automatically replaced with multiple suction nozzles (12), multiple transfer stations (8), 2x2 "/4x4" gel pack/wafer pack And the automatic loading and unloading method of magazine cache, as well as the upper level software with complete collaborative functions and simple operation, meet the needs of customers for rapid mass production and high production capacity.
The MicroStar series EF8621 eutectic die bonder machine can provide flexible and diverse packaging capabilities for advanced packaging. Adopting a dual workbench structure, it has both eutectic and dipping functions, which can meet the requirements of multi chip mounting. While achieving high-precision bonding of laser chips, it can also achieve more efficient eutectic efficiency. By using pulse heating, the temperature rise rate can reach 50 ° C/S, which can achieve precise temperature control during the welding process, ensuring welding quality and stability. The uniquely designed horizontal turret mounting head can achieve dynamic automatic replacement of 12 suction nozzles during the mounting process, with a high degree of automation. It can achieve fast and accurate welding operations, significantly improving production efficiency and product quality.
Regarding Bozhon:
Bozhon Precision Technology Co., Ltd
Bozhon Precision Technology Co., Ltd. (stock code: 688097) was established in 2006, with a research and development center and a production base of 400000 square meters, focusing on the field of industrial equipment manufacturing.
Our business focuses on digital equipment fields such as consumer electronics, new energy vehicles, semiconductors, key components, and smart warehousing and logistics. We have established deep cooperation with numerous Fortune 500 and industry leading enterprises.
Suzhou Bozhon Semiconductor Co., Ltd
Suzhou Bozhon Semiconductor Co., Ltd., affiliated with Bozhon Precision (stock code: 688097), relies on the group's more than 20 years of technological accumulation, and is based in the semiconductor field. It provides excellent high-precision equipment and chip packaging solutions for industries such as IC packaging, optical communication packaging, power device packaging, and advanced packaging worldwide.
Bozhon Semiconductor is committed to becoming a leader in the Chinese semiconductor industry, promoting the development of advanced semiconductor processes and industrial upgrading through research and development and product innovation at the micrometer, submicron, and nanometer levels, and continuously providing cutting-edge products for the industry.
