For different laser package designs, the high precision requirements for laser chip packages are usually between 1.5um and 5um. This high precision requirement is to ensure the stability and performance of the laser, in terms of optical and electrical characteristics can meet the design requirements. A reliable connection is achieved by melting the eutectic metal between the chip and the substrate. This connection provides good electrical connection and thermal conductivity while ensuring the reliability and stability of the package. The future development direction of LiDAR is long range and high precision detection under low power consumption. The next generation of domestic LiDAR will continue to use the ToF ranging technology with innate advantages on the technical route. On the basis of existing products, it mainly upgrades the miniaturized integration of multi-chip, which reduces the size and power consumption while improving the performance.