Power Semiconductors
Power Semiconductors
Power semiconductor applications cover all areas of the electronic industry chain, with the rapid development of new energy vehicles, new energy and other industries, the scale of power semiconductor industry will gradually increase, IGBT, the third generation of power semiconductor will be the fastest growing field.
The Challenge
The mounting of power semiconductor chips is a key link that affects the performance, reliability and cost of the devices. Power semiconductor chips will produce a lot of heat when working, if not timely heat dissipation will affect the performance and life of the chip, the device packaging technology must have a good heat dissipation effect, traditional packaging materials and technology are subject to great limitations to meet the needs of high temperature applications.
Our Recommendation
Packaging technology is changing to multi-chip packaging, multi-chip packaging can integrate multiple devices, can better improve the performance and reliability of the entire system, and is widely used in high-power applications and military applications.
We recommend the use of FastStar series DU9721 high speed and high precision epoxy die bonder.
Application Results
FastStar Series DU9721 High speed and high precision die bonder is the ideal tool for power semiconductor sintering and IC package hot pressing bonding.
Design of high precision pick and fit system
The high precision gantry double drive linear motor platform is adopted to meet the high response and high precision requirements of XY motion, and the dynamic response performance and stability of the motion platform are continuously optimized by co
High production efficiency, high patch yield
High-precision ZR module, tool change module, down vision module and process observation camera module not only meet the requirements of high-precision force control fitting, but also realize online dynamic tool change and real-time process monitoring, combined with high-precision vision system to ensure the accuracy of the fitting system.
High efficiency eutectic platform design
At the same time, it has the function of nitrogen protection and nitrogen rapid cooling, which can achieve rapid rising and cooling, the highest heating rate is 80℃/s, and the cooling time is up to 5s from 340℃ to 200℃.
Flexible feeding options
We can configure the system according to your feeding requirements: Waffle boxes, Gel-Pak™, wafers, rolls and custom trays.
High precision vision system design
Using dual vision system design, greatly reduce the impact of external factors on the vision system, can automatically switch, taking into account different sizes of materials.
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