Suzhou Bozhon Semiconductor CO.,Ltd

AOI Inspection Machine

The CesiStar Series AOI provides high performance, fully automated optical inspection of packaged integrated circuit(IC) components. It leverages high sensitivity with 2D/3D inspection and measurements to determine final package quality for a wide range of device types and sizes.

High precision

High efficiency

High flexibility

Easy to expand

MicroStar EF8621

The EF8621 eutectic die bonder is mainly used in COC and COS process scenarios, providing high-precision mounting and multi feeding modes to solve customer pain points such as low yield and low production.

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Application Scenarios
Product Parameters
Related Products
Free Proofing

Application Scenarios

Product Parameters

±3μm @ 3σ

Placement accuracy
Eutectic/ Adhesive dipping

Placement process
15-25s (Eutectic)5-7s (Adhesive dipping)

Efficiency

High precision

The repeated accuracy of the mounting air flotation platform is 0.5μm

High efficiency of eutectic

Twin eutectic platform

（The eutectic temperature between 200 and 340 ℃ only takes 3.2s to rise, and the cooling between 340 and 200 ℃ only takes 6.5s）

Dynamic tool change

12 tool change chucks fully automatic tool change

Dual view module

Free switching of high and low magnification lenses (1&5x)

Related Products

MicroStar series

MicroStar EF9621

MicroStar series

MicroStar EH9721

Free Proofing