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Focusing on car mounted LiDAR, Bozhon Semiconductor delves into optoelectronic device packaging
2024-06-24
On June 22nd, the 6th LiDAR Forward looking Technology Exhibition and Exchange Conference of the EAC2024 E-commerce Automotive Industry Conference, which lasted for two days, successfully concluded at the Suzhou International Expo Center.
The conference focused on exploring the technological applications and future development issues of cutting-edge technologies and products such as LiDAR, in vehicle fiber optic communication, and advanced packaging of optoelectronic semiconductors in fields such as autonomous driving, industry, and smart cities. It also showcased the scientific research achievements of numerous enterprises in the fields of optical chips, optical devices (active and passive), optical modules, communication testing solutions, packaging and testing technologies, and packaging and testing equipment.
Direct to the scene | Full scene interpretation
Suzhou Bozhon Semiconductor Co., Ltd. (hereinafter referred to as Bozhon Semiconductor) was invited to participate in and present high-precision die bonding solutions at this conference. As one of the many exhibitors, Bozhon Semiconductor presented high-precision eutectic die bonding equipment in the form of multimedia visualization and demonstrated mounting solutions for LiDAR devices, attracting numerous customers and visitors from home and abroad to stop and visit. The booth was full of people. The professional sales team of Bozhon Semiconductor is still on-site to provide in-depth explanations to many visiting customers on the characteristics and advantages of equipment used for LiDAR mounting, share successful cases in the field of optoelectronics, and help customers better understand Bozhon Semiconductor's professional strength and rich industry experience.
Exciting speech | Co exploration of optical device packaging
In addition, Bozhon Semiconductor actively participated in the concurrent activities of this exhibition. Fu Jiangbo, R&D Director of Bozhon Semiconductor, delivered a keynote speech on "Empowering Large scale Production of Laser Radars with High Precision Placement Capability" at the sub forum on precision optical components and intelligent manufacturing. Together with representatives of well-known industry enterprises and experts, we discussed diversified packaging forms and process requirements for automotive grade laser radars, how to help optical devices achieve high reliability and high precision placement solutions, and provide suggestions for industrial upgrading.
He mentioned in his sharing that in the future, the automotive field may become one of the main application areas of LiDAR. According to Yole's forecast, the global LiDAR market size will reach 6.3 billion US dollars by 2027, with the automotive ADAS LiDAR market expected to experience rapid growth in the next 5 years, with an annual compound growth rate of 73% from 2021 to 2027. The market size is expected to increase from 38 million US dollars in 2021 to 2 billion US dollars in 2027, becoming the largest application area in the LiDAR industry.
source: Yole, Oriental Securities Research Institute
The chip packaging forms in LiDAR modules are diverse, each with its specific application scenarios and advantages. Common ones include TO (metal packaging), DFB (distributed feedback), FP (cavity type), VCSEL (vertical cavity surface), etc. During the packaging process, key chips are mounted using high-precision solid crystal mounting machines, which require deep cavity mounting capabilities to meet the packaging requirements of automotive grade LiDAR.
The EH9721 eutectic machine of Bozhon Semiconductor MicroStar series is an ideal mounting equipment for optoelectronic device packaging solutions. Advanced design and high-quality driving structure enable its mounting accuracy to reach ± 0.5-3 μ m, which can meet the high-density mounting requirements of single chip and multi chip automotive LiDAR devices. It is compatible with various packaging processes such as CoC, CoB, and CoS. It is worth mentioning that this series of equipment has undergone multiple technological upgrades and iterations, and currently has key technology layouts such as head heating, large-sized eutectic stage, high-precision closed-loop force control, etc. It can effectively provide uniform heat distribution during the mounting process, reduce the impact of thermal and mechanical stress on the performance of laser chips, and further improve the reliability and stability of mounting.
The chip packaging forms in LiDAR modules are diverse, each with its specific application scenarios and advantages. Common ones include TO (metal packaging), DFB (distributed feedback), FP (cavity type), VCSEL (vertical cavity surface), etc. During the packaging process, key chips are mounted using high-precision solid crystal mounting machines, which require deep cavity mounting capabilities to meet the packaging requirements of automotive grade LiDAR.
The EH9721 eutectic machine of Bozhon Semiconductor MicroStar series is an ideal mounting equipment for optoelectronic device packaging solutions. Advanced design and high-quality driving structure enable its mounting accuracy to reach ± 0.5-3 μ m, which can meet the high-density mounting requirements of single chip and multi chip automotive LiDAR devices. It is compatible with various packaging processes such as CoC, CoB, and CoS. It is worth mentioning that this series of equipment has undergone multiple technological upgrades and iterations, and currently has key technology layouts such as head heating, large-sized eutectic stage, high-precision closed-loop force control, etc. It can effectively provide uniform heat distribution during the mounting process, reduce the impact of thermal and mechanical stress on the performance of laser chips, and further improve the reliability and stability of mounting.
In the future, Bozhon Semiconductor will continue to follow the forefront of the industry, strengthen close cooperation with various industries, continue to provide customers with high-precision, high reliability, and efficient mounting solutions, and promote the innovation and localization process of packaging technology.
