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OSIC 2024|Bozhon Semiconductor Wins Prestigious Awards
2024-12-07

On December 5-6, the two-day OSIC 2024 2nd Optoelectronic Intelligence Conference was held in Suzhou. Bozhon Semiconductor was invited to attend and bring the high precision placement solution for high speed optical modules to show Bozhon Semiconductor's professional ability and corporate style, and was unanimously recognized by the industry associations and the expert team, and won the authoritative awards of Outstanding Equipment Award of Optical Communication Industry 2024.


OSIC 2024 OptoWise Conference focuses on the outlook of innovation opportunities in the optical communication industry in 2025, the low altitude economy and the optical-electric interconnection of air and space industry, and the optical-electric interconnection of automotive intelligence and robotics, aiming at exploring how to utilize advanced optical communication technology to promote the in-depth fusion of different industries, and to seek for the future development of supply chain industry.

Product Showcase, Site Direct

As one of the exhibitors at the conference, Bozhon Semiconductor demonstrated its high-precision placement solutions for high-speed optical modules, which attracted many domestic and overseas customers as well as on-site attendees to stop by for consultation and exchanges. Bozhon Semiconductor's professional sales team explained in detail the advantages and features of the mounting products and systems, and shared the successful experience of participating in the mounting of different device chips made of different materials in different encapsulation processes for various customers.


High-speed optical module market demand to benefit from AI-driven and dramatic growth, and optical module manufacturers high-speed optical module customized design requires flexible packaging process, which relies on the packaging automation equipment vendors of the full-stack capabilities in packaging accuracy, motion control, process types to provide comprehensive support. Eutectic is a key link in the core chip packaging of optical modules, and its accuracy and stability will deeply affect the reliability of the optical module work performance. Bozhon Semiconductor MicroStar series of high-precision eutectic placement equipment not only meets the market's requirements for high precision and stability of high-speed optical modules, but also responds to the diverse packaging design of optoelectronic devices, providing the best chip packaging solutions for process validation development as well as mass production scenarios.


Award-winning, industry-recognized

The conference not only focused on the supply chain ecology of optical communication to carry out diversified thematic activities, but also held the “ICC Xunshi - Optical Communication Industry Heroes List” award ceremony at the same time. Bozhon Semiconductor was honored with the “2024 Outstanding Equipment Award in Optical Communication Industry” for its EH9722 Eutectic die bonder. This award is a high affirmation of Bozhon Semiconductor's continuous innovation and technology development.


Liu Jinbao, Marketing Director of Bozhon Semiconductor, as a representative of the company (third from the left) went on stage to receive the award.



MicroStar series EH9722 eutectic die bonder has the ability to ensure ±3um placement accuracy, while providing a variety of placement processes such as eutectic, dipping, dispensing, UV curing, etc. The modular system architecture is scalable to meet the requirements of exploratory process validation development and mass production. In addition, its modular system architecture is scalable to meet the requirements of exploratory process validation development and mass production, creating excellent customer value.

The 2024 “ICC Xun Shi - Optical Communication Industry Heroes List” was initiated by ICC Xun Shi, with the Shenzhen Electronics Industry Association Optoelectronics Information Technology Specialized Committee as the academic guiding unit, and a team of more than 260 industry experts as the judging panel, adhering to the principles of fairness and authority in running the awards, as well as being a guardian of the evaluation of the cases participating in the awards. As a highly recognized leading professional award in the industry, ICC Xunshi - Optical Communication Industry Heroes List starts from the optical communication industry chain, aiming to encourage enterprises and brands with potential for technological innovation and business innovation, to promote the construction of an innovative and open ecosystem among enterprises in the supply chain, and to promote the sustainable development of the industry.


Looking to the future, the beginning remains the same

Extensive global project experience, professional service capability, and reliable equipment technology are the core competitiveness of Bozhon Semiconductor. In the future, Bozhon Semiconductor will continue to improve the product technology innovation ability, continue to optoelectronic / microwave / RF / power devices and other high-reliability, high-precision chip placement process to drill, and continue to meet the customer's individual needs, to provide customers with more efficient, intelligent, stable solutions, to help the industry's sustainable development.
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