0512-63414949-80512
Service hotline
Focus on the power device , Bozhon Semiconductor wins the Golden Feather Award
2024-04-24
● CIAS 2024
On April 24th, the CIAS2024 Power Semiconductor New Energy Innovation and Development Conference successfully concluded in Suzhou. The conference brings together industry elites to seek development strategies, starting from different industry chain links such as new energy vehicle electric drive and control industry, optical storage and inverter industry, compound semiconductor materials industry, power semiconductor industry, packaging and testing industry, exploring different breakthrough paths to promote innovation and sustainable development of the industry.
In the CIAS 2024 Golden Feather Award for Power Devices, Modules, and High Quality Suppliers, Suzhou Bozhon Semiconductor Co., Ltd. was awarded the Top 50 High Quality Suppliers of 2024. With the excellent technical performance and application innovation of the FastStar series high-speed and high-precision die attach machines, it has received unanimous praise from users, industry experts, and media. This not only confirms Bozhon Semiconductor's innovative strength and strong brand influence in the field of power devices, but also reflects Bozhon Semiconductor's solid position in power device and module packaging applications.
MarketTrend
Market Trends of Power Device Modules
The application of power semiconductors covers various fields in the electronic industry chain. With the rapid development of industries such as new energy vehicles, photovoltaics, and energy storage, the industrial scale of power semiconductors will gradually increase. IGBT and third-generation power semiconductors will be the fastest-growing fields.
With the transfer of global manufacturing, China has gradually become the world's largest IGBT market. According to a report by Yole Group, the global IGBT market size is expected to reach $8.4 billion by 2026. China is the world's largest consumer market for IGBT, accounting for approximately 40% of the global IGBT market size. It is expected that the Chinese IGBT market size will reach 52.2 billion yuan by 2025.
Source: Yole, China Commercial Industry Research Institute
Solution
Based on IGBT device mounting solution
The packaging technology of IGBT devices is shifting towards multi chip packaging, which can integrate multiple devices and better improve the performance and reliability of the entire system. It is widely used in high-power applications and military applications.
The DU9721 series high-speed and high-precision die attach machine from Bozhon Semiconductor is an ideal tool for power semiconductor sintering and IC packaging hot pressing bonding. Through self-developed motion control technology, it can achieve a high accuracy of ± 10 μ m @ 3 σ and achieve an ultimate efficiency of 3000pcs/h (depending on the process). The DU9721 series products adopt an open architecture and modular design, providing customers with the ultimate efficiency of on-demand customization capabilities. For power devices and advanced chip packaging, the solder process can achieve high bonding force through the addition of solder modules and bonding heads. By integrating functions such as glue dispensing, automatic tool changing, and hot pressing bonding, it is possible to process large-sized wafers, achieve multiple substrate transfer methods, and meet packaging processes such as solidification, Flip chip, and SiP.
High precision ： the accuracy of ± 10 μ m @ 3 σ;
The optimal yield：
through self-developed motion control technology, can achieve a SMT efficiency of up to 3000pcs/h (depending on the process);
Flexible feeding options：
the device is compatible with multi size wafers through integrated dispensing, automatic tool changing, hot pressing, and other functions;
Modular design ：
open architecture and modular design can provide customers with the ultimate efficiency of on-demand customization capabilities.
At present, the FastStar series DU9721 die attach machine has undergone technical verification in multiple leading IGBT module enterprises. It is at the forefront of the industry in terms of application innovation, market potential, and technological strength in the advanced packaging field of IGBT, and has strong competitiveness. In the future, driven by technological innovation and scenario based solutions, Bozhong Semiconductor looks forward to continuously empowering customers in the power device field and achieving intelligent upgrades.
