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Bozhon Semiconductor: Successful Delivery of International Projects and a New Stage in Globaliz
2024-01-22
On January 20, 2024, Suzhou Bozhon Semiconductor Co., Ltd. self-developed MicroStar Series EH9721 automatic high-precision eutectic die bonder passed the strict technical verification of international customers in the optical communication industry and successfully completed the shipment and delivery.
In this project delivery ceremony, Bozhon Semiconductor director Yu Jun as a representative speech, he said, Bozhon Semiconductor focuses on semiconductor process equipment research and development and production, three years to sharpen the sword, independent research and development of high-precision eutectic mounter equipment has won the industry highly recognized, and achieved gratifying sales results and market share. The rapid development of Bozhon Semiconductor is inseparable from the recognition and support of customers, suppliers and Bozhon Precision Group.
Keep up the good work, keep up the good work
The delivery of MicroStar series EH9721 eutectic die bonder is the first international project delivery case in 2024 following the successful delivery of several domestic projects. During the execution of this project, the Bozhon Semiconductor project team cooperated closely and efficiently, overcame many difficulties such as complex processes and tight deadlines, and completed the nodal tasks of each stage with high quality and quantity in the modularization and customization of the equipment, as well as in the manufacturing and other aspects, and ultimately achieved the delivery on schedule.
MicroStar series EH9721 eutectic die bonder has excellent performance in terms of placement accuracy, UPH, modular design, etc. The comprehensive placement accuracy reaches ±3μm, which can be applied to various placement processes such as COC, COS, Gold Box, etc. By adopting nanometer absolute double feedback gantry structure, multiple transit stations (8), 2x2"/4x4" gel pack Automatic loading and unloading by utilizing nano absolute dual feedback gantry, multiple staging stations (8), 2x2"/4x4" gel pack, /waffle pack, and magazine cache. Equipped with horizontal turret mounting head, 12 nozzles can be dynamically and automatically changed during the mounting process, which significantly improves the speed and productivity of the machine, with a wider range of applications and more suitable for batch production.
The future looks promising
The successful delivery of the first batch of international project equipment in 2024 marks a big step forward in the globalization process of Bozhon Semiconductor. Bozhon Semiconductor will further strengthen its ability to provide global customers with full life-cycle delivery of products, and meet the needs of customers in the field of optical modules, LIDAR, RF devices and other segments in the process of chip packaging for placement equipment and packaging solutions.
In the future, in the product level, Bozhon Semiconductor will continue to follow the market demand, focusing on semiconductor process equipment, technological innovation and upgrading iteration, and polishing the product to the extreme. At the business level, we will adhere to the strategy of taking both internal and external factors into consideration and plowing into niche markets, continue to strengthen the construction of the international team, build a safe and reliable supply chain, and enhance the exploration and practice of international development, so as to provide more diversified services and product options for the global customers of Bozhon Semiconductor.
