AOI Inspection Machine

The CesiStar Series AOI provides high performance, fully automated optical inspection of packaged integrated circuit(IC) components. It leverages high sensitivity with 2D/3D inspection and measurements to determine final package quality for a wide range of device types and sizes.

High precision
High efficiency
High flexibility
Easy to expand

CesiStar TV6-10T-TC
The CesiStar TV6-10T-TC mainly applies advanced processes such as FCBGA, Memory and POP are equipped with high-precision micro crack and TOP 3D detection modules, providing quality assurance for advanced packaging customers.
Product Parameters
  • 5μm
    3D rep/acc
  • 3x3mm-58x58mm
    Device Size
  • BGA/POP/Memory
    Chip packaging type

High precision 3D measurement

The accuracy and repeatability up to 5um


Comprehensive detection function

6 sides, Top 2D/3D, Bottom 2D/3D, Micro Crack, Passive component detection

Modular configuration

Equipped with TOP 3D and high-precision microcrack module


Intelligent defect classification function

Intelligent defect classification algorithm engine

Free Proofing