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5μm3D rep/acc
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3x3mm-58x58mmDevice Size
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BGA/POP/MemoryChip packaging type
Application Scenarios
Product Parameters
![](/uploadfiles/chanpin/20240326195853221.png)
![](/uploadfiles/image/pro-icon5.png?cHJvLWljb241LnBuZw==)
High precision 3D measurement
The accuracy and repeatability up to 5um
![](/uploadfiles/image/pro-icon6.png?cHJvLWljb242LnBuZw==)
Comprehensive detection function
6 sides, Top 2D/3D, Bottom 2D/3D, Micro Crack, Passive component detection
![](/uploadfiles/2024/03/20240326200102548.png?MDMt5Lqn5ZOB54m554K5Mi5wbmc=)
![](/uploadfiles/2024/03/20240326200127419.png?MDMt5Lqn5ZOB54m554K5My5wbmc=)
![](/uploadfiles/image/pro-icon7.png?cHJvLWljb243LnBuZw==)
Modular configuration
Equipped with TOP 3D and high-precision microcrack module
![](/uploadfiles/image/pro-icon8.png?cHJvLWljb244LnBuZw==)
Intelligent defect classification function
Intelligent defect classification algorithm engine
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Free Proofing