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5μm3D rep/acc
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3x3mm-58x58mmDevice Size
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BGA/POP/MemoryChip packaging type
Application Scenarios
Product Parameters


High precision 3D measurement
The accuracy and repeatability up to 5um

Comprehensive detection function
6 sides, Top 2D/3D, Bottom 2D/3D, Micro Crack, Passive component detection



Modular configuration
Equipped with TOP 3D and high-precision microcrack module

Intelligent defect classification function
Intelligent defect classification algorithm engine
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