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Moving Forward | Bozhon Semiconductor Receives Outstanding Equipment of the Year Award

2023-12-29

On December 28, the "2023 First Suzhou Optoelectronic Technology Industry Forum" organized by Xun Shi, an authoritative media in the optical communication industry, was successfully held in Suzhou. With the technical topics of "Next-Generation Interconnect Technology Empowering AI Arithmetic and Optical Networks" and "Optoelectronic Technology Convergence and Development Opportunities and Challenges", the conference brought together senior executives of enterprises in the fields of optical communication, semiconductor, and other fields as well as experts from scientific research institutes, to explore the opportunities of the next-generation high-speed optoelectronics industry innovations.

As a semiconductor advanced packaging automation equipment provider, Bozhon Semiconductor was invited to participate in the meeting, and with the "MicroStar series EH9721 automatic high-precision eutectic die bonding machine" product, from a number of strong enterprises to stand out, was awarded the 2023 ICC Xunshi Heroes Award for excellent equipment.

Introduction

Products Introduction

MicroStar series EH9721 automatic high-precision eutectic die bonder is a multifunctional chip placement equipment developed and produced by Bozhon Semiconductor specifically for the field of optical modules, with full-stack self-research. With ±1.5μm @ 3σ placement accuracy, it is equipped with eutectic placement, dip placement and Flip Chip placement functions, which can meet the needs of multi-chip placement. The modular design concept makes it highly flexible manufacturing capability, equipped with intelligent calibration and data management system, making it capable of process traceability and management.

In the future, 400G, 800G and 1.6T optical modules will gradually become the main products in the market. In view of the characteristics of high speed, large bandwidth, low power consumption and miniaturization of optical modules, this model is compatible with COC, COS, GOLD BOX and other different packaging forms, and can meet the customer's rapid mass production needs through the use of nanometer absolute double feedback gantry structure, multiple nozzles (12) dynamic automatic replacement, multiple transit stations (8), 2x2"/4x4" gel pack/waffle pack, and cartridge cache automatic loading and unloading methods, in conjunction with the fully functional and easy-to-operate host software. ), 2x2"/4x4" gel pack/waffle pack, and magazine buffer automatic loading and unloading, together with the full-featured and easy-to-operate software, to meet the customer's needs for rapid mass production and high productivity.

Highlights

Product Highlights

High flexibility

Chip size compatibility: 8 transit tables (0.15*0.2mm-5*5mm); substrate size compatibility: large working size (eutectic: 18*22mm; solid crystal: 130*200mm);

More complete packaging process: COC/COS/GOLD BOX eutectic process, AOC/COB/LENS solid crystal process, Flip Chip flip-chip process;

More complete loading methods: 2 x 6" Wafer, 8 x (2*4) Gel-paks, support flow line auto widening docking and loading and cartridge loading system;

Extra large take-up size: 9 (3*3) Gel-paks/other customized fixtures, support magazine take-up system；

Highly accurate

Ultra-high laminating precision: laminating comprehensive precision ±1.5μm@ 3σ (standard sheet);

Ultra-high force control system: pressure control accuracy 10-50g (±2g), 50-300g (±10%);

Automatic calibration algorithm: integrated automatic calibration module, the equipment automatically calibrates the system accuracy, reducing manual intervention and debugging;

Advanced compensation technology: integrated Table-Mapping two-dimensional compensation, to protect the comprehensive accuracy of the equipment;

High speed

Gantry structure design: gantry structure design to enhance the operation efficiency of each axis and product compatibility;

Advanced operation and control system: high-performance ironless core motor + carbon fiber structure design, cross axis acceleration 2.5g/2m, gantry axis acceleration 2g/1.5m;

High speed streamline design: variable speed streamline design, saving streamline transportation time;

Multi-magazine cache design: reduce the frequency of manual loading and unloading;

This award is not only a recognition of the comprehensive strength of the product, but also an affirmation of the innovative research spirit of Bozhon Semiconductor. In the future, Bozhon Semiconductor will continue to create unique value for the optical communication industry with its innovative products, technologies and solutions, helping to bring optoelectronic packaging to a new level.

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