This spring, we met as scheduled, broke through with resilience, and together witnessed this grand event in the Asian laser, optical, and optoelectronic industries! As an exhibition platform that showcases innovative achievements in the industry and promotes upstream and downstream linkage, the three-day Laser Photonics China 2024  was successfully concluded on March 22 at the Shanghai New International Expo Center.

This grand event has set up five exhibition areas, bringing together core enterprises in the optoelectronic industry from all over the world to discuss the latest processes and development trends of the industry. It focuses on showcasing comprehensive product content covering laser and optoelectronics, optics and optical manufacturing, laser production and processing technology, imaging and machine vision, detection and quality control, promoting the development and innovation of optoelectronic technology, and exploring the future of the optoelectronic industry.

As a semiconductor process equipment manufacturer, Bozhon Semiconductor is deeply involved in product development and overall solutions in the back-end packaging process. With the theme of "AI empowerment, leading" chip "packaging," Bozhon Semiconductor showcases the most cutting-edge solutions and practical results for chip mounting and AOI visual inspection of IC chips in application scenarios such as optical modules, LiDAR, and high-power lasers. The company presented its first answer sheet at the Munich Light Expo.

At this exhibition, Bozhon Semiconductor showcased for the first time the MicroStar series EH9721 fully automatic high-precision eutectic die bonding machine and the CesiStar series IR9821 AOI inspection machine.

The MicroStar series EH9721 fully automatic high-precision eutectic die bonding machine is an ideal equipment for optoelectronic packaging, which combines eutectic , dipping , and Flip Chip  functions, and can meet the needs of multi chip and multi process  scenarios. By adopting a nanoscale absolute value dual feedback gantry structure, multiple suction nozzles (12) for dynamic automatic replacement, multiple transfer stations (8), 2x2 "/4x4" gel pack/wafer pack, and automatic loading and unloading of magazine cache, the collaborative upper software with complete functions and simple operation can meet the needs of customers for rapid mass production and high production capacity.

The CesiStar Series IR9821 AOI Inspection Machine is a fully automatic visual inspection equipment that uses optical principles to detect chip defects. It has the appearance inspection and measurement functions of IC chips and uses high-resolution color imaging technology to detect defects such as cracks, edges, discoloration, depressions, and protrusions. Its high-resolution coplanarity measurement has good repeatability, and the automatic sorting technology equipped with AI algorithms can achieve rapid classification of defect types and improve packaging quality.

During the exhibition, Bozhon Semiconductor was interviewed by industry authoritative media platforms such as Xunshi Optical Communication, Yimao Information, and Jung Industrial Media.

On behalf of Bozhon Semiconductor, Senior Product Manager Zhang Genfu conveyed our expectations and confidence in the optoelectronic and semiconductor markets to the audience. According to the International Semiconductor Industry Association (SEMI), semiconductor equipment sales are expected to rebound in 2024 and exceed $124 billion in 2025, reaching a historic high.

△Data source: International Semiconductor Industry Association (SEMI)

At the same time, he also introduced our company's development situation, market layout, as well as the products and solutions recommended at the Munich Light Expo to the media.

It is worth mentioning that the unique interactive settings such as TOUR stamp check-in, surprise lottery, technology sharing live broadcast, and product Q&A at the Bozhon Semiconductor booth have also brought a unique exhibition experience to everyone. Since the opening of the exhibition, the booth has attracted a large number of visitors and media.

Bozhon Semiconductor is committed to promoting the development and industrial upgrading of advanced semiconductor processes through technology research and product innovation at the micrometer and submicron levels. In the future, Bozhon Semiconductor will continue to leverage its technological advantages and cooperate extensively with upstream and downstream industries, governments, associations, and organizations to support innovation and high-quality development in the semiconductor and optoelectronic industries.

The curtain will not end, and a new journey is already in sight. Until next year's  Expo, we will surely meet again at a new peak.