Suzhou Bozhon Semiconductor CO.,Ltd

Photoelectron

With the continuous evolution of AI computing power, optoelectronic chips, as the core components of optical communication, are facing huge market demand and technical challenges. The advent of the era of large computing power has promoted the evolution and upgrading of optical communication technology, making high speed, integration, and large capacity the core demands of optical chips.

The Challenge

There are many packaging processes of optical modules, which are different from the common semiconductor chip packaging, especially in the link of patch, wiring, lens coupling, there are certain technical barriers, and the quality of the process directly affects the yield or performance of the product. In the patch process, optoelectronics face some very specific challenges.

Consider the key requirements of the actual production process and alignment

High precision pick and fit requirements

Multiple chip bonding technologies (epoxy, eutectic, dipping)

Patch efficiency needs to be cost-effective

Modular design, can meet the diversified functional needs of customers

Our Recommendation

Optical module manufacturers need to adopt a variety of assembly techniques to solve the problem of alignment and fitting. Although active alignment of the launcher is an option, it is time-consuming and costly. As a result, processes utilizing high-precision and repeatable assembly platforms are more desirable, increasing production efficiency and reducing costs. This helps ensure accurate alignment during optical fitting, while accommodating a variety of mounting technologies to meet manufacturers' needs.

Therefore, considering the solutions needed to meet these challenges, we recommend the MicroStar series EH9721 fully automatic high-precision eutectic die bonding machine.

Application Results

These configuration options make the MicroStar Series EH9721 fully automatic high-precision eutectic mounter a complete assembly solution.

Design of high precision pick and fit system

The high precision gantry double drive linear motor platform is adopted to meet the high response and high precision requirements of XY motion, and the dynamic response performance and stability of the motion platform are continuously optimized by co

High production efficiency, high patch yield

High-precision ZR module, tool change module, down vision module and process observation camera module not only meet the requirements of high-precision force control fitting, but also realize online dynamic tool change and real-time process monitoring, combined with high-precision vision system to ensure the accuracy of the fitting system.

High efficiency eutectic platform design

At the same time, it has the function of nitrogen protection and nitrogen rapid cooling, which can achieve rapid rising and cooling, the highest heating rate is 80℃/s, and the cooling time is up to 5s from 340℃ to 200℃.

Flexible feeding options

We can configure the system according to your feeding requirements: Waffle boxes, Gel-Pak™, wafers, rolls and custom trays.

High precision vision system design

EH9721 machine, using dual vision system design, greatly reduce the impact of external factors on the vision system, can automatically switch, taking into account different sizes of materials.