What is AOI? AOI (Automatically Optical Inspection) is the abbreviation for Automatic Optical Inspection, which is a device that uses optical principles to detect common defects encountered in manufacturing production. AOI inspection is widely used in electronic components such as PCBs, display panels, and semiconductor chips. The accuracy and detection requirements vary in different fields, so the technical solutions for inspection are also different.

Panoramic Schematic of Electronic Components Industry

In the field of semiconductor packaging and testing, optical inspection AOI is generally divided into four channels of light inspection. The first channel is wafer inspection, the second channel is external particle defect inspection, the third channel is package/ wire bonding inspection, and the fourth channel is plastic encapsulation appearance inspection.

Packaging process flowchart

The fourth optical inspection is to check the appearance of the chip, in the process flow, the equipment is used in the last process of the chip packaging process.The equipment is used in the last process of chip packaging process, mainly for the chip process may produce scrap: such as molding defects, plating defects, BGA Balls, Leads, etc. for inspection and 3D measurement, and at the same time，OK/NG sorting was performed on the chip after detection, is an indispensable part of the semiconductor chip production process.

Encapsulating Chip AOI Workflow

Introducing the equipment using BOZHON Semiconductor AOI detection machine, BOZHON Semiconductor's AOI detection machine is located in the fourth light inspection, the CesiStar Series is a high-speed and highprecision fully automatic vision detection device that uses optical principles to detect chip defects, widely used in semiconductor, consumer electronics, optics and other research and manufacturing. It can achieve detection functions for various types of chip packaging such as BGA, LGA, QFN, QFP, etc. to ensure the final appearance quality and yield improvement of the packaging.

Two of the products in this line, the IR9721 series, provide highspeed detection for Tray to Tray/Tray to Reel. The IR9822 series offers fully automated optical detection for Tray to Tray, with higher sensitivity for detecting minor defects. When combined with the Top 3D detection station, it provides more comprehensive detection capability for SIP packaging.

The technical highlights of this series of equipment are:

High precision

3D measurement accuracy of 5um

Support for 100um BGA balls

Support for detecting surface dents and bulges

High throughput

UPH up to 40k (QFN 5*5)

High adaptability

Compatible with various chip packages such as BGA, CSP, WLP, LGA, QFN, QFP

Covering chip sizes from 3*3mm to 120*120mm

User-friendly

Fast changeover time

With this, we have gained a preliminary understanding of AOI detection. If you have any questions, please feel free to leave a comment.