Eutectic machines play an indispensable role in the field of optical modules and optical communications. In the optical communication system, the optical module is the core component in the field of optical communication transmission that converts electrical signals into optical signals and transmits them. Optical modules are usually composed of optical transmitter devices (TOSA, including lasers), optical receiver devices (ROSA, including photodetectors), functional circuits and optical (electrical) interfaces.

The main role of TOSA is to realize the electrical signal to optical signal, mainly including laser, MPD, TEC, isolator, Mux, coupling lens and other devices, there are T-CAN, GoldBOX, COC (chip on chip), COB (chip on board), etc. The main role of ROSA is to realize the optical signal to electrical signal. Built-in devices mainly include PD/APD, DeMux, coupling components, etc., and the package type is generally the same as TOSA. PD is used for short-range and medium-range optical modules, and APD is mainly applied to long-range optical modules.

To ensure efficient optical signal transmission and stable performance, optical modules must be packaged with high precision. Eutectic machines, as an advanced packaging equipment, provide highly automated and precise assembly solutions for optical module manufacturers. The packaging process of optical modules can be roughly categorized into three major types: TO Can, Box, and COB. The COB (Chip on Board) package is a tinbased alloy that is heated at high temperature and laminated to the substrate, and then bonded to the leads to achieve electrical connections to drive the chip, and this type of package is also widely used in data center optical modules. Compact structural design of optical modules and highpower chips, laser iteration, multiple devices gathered together to produce heat dissipation challenges, the device temperature will affect the chip, laser stability, and ultimately lead to the failure of the optical module. According to statistics, the higher the operating temperature of the optical module, the higher the failure rate, so the conductive adhesive's heat dissipation ability, operating temperature, bonding performance, etc. will have an impact on the reliability of the chip, laser.

For optical transceivers, CoC/CoS bonding is performed first. The CoC/CoS is then soldered to a common substrate used to attach the lens/reflector, which is then mounted into the package. The latest packaging trend is to connect more components (such as lasers, capacitors, and thermistors) to a common carrier by eutectic or epoxy bonding the chips together. For gold-box packages, such as transceivers with high-power lasers, CoC/CoS bonding is often performed first, and then the CoC/CoS is bonded to a common substrate used to attach the lens/reflector before it is placed in the package. More chips or dies need to be attached to a common carrier by eutectic die bonding or epoxy die bonding.

The high degree of automation and precision of the eutectic machine brings many advantages to the field of optical communications. Firstly, it greatly reduces the influence of human factors on the quality of packaging and improves the consistency and stability of the manufacturing process. Secondly, it can realize high-efficiency mass production and reduce the manufacturing cost, making the optical module more competitive in the market.

Bozhon Semiconductor's fully automatic highprecision eutectic machine MicroStar products, including models EF8621, EF9621, EH9721, EF7921, EG9921, are leading multifunctional chip mounting equipment in efficiency and accuracy. Users can choose different mounting processes such as eutectic, dipping, Flip Chip, etc. to complete multichip mounting. The mounting accuracy can be selected according to their needs by ± 0.5 μ M~± 3 μ m. To meet the actual production line environment and R&D innovation needs of different users through flexible manufacturing. For optical communication and semiconductor customers' demand for highprecision, highstability, lowcost and highefficiency manufacturing, we provide fully automated, high-precision chip placement, AOI inspection and other intelligent equipment that are localized.