Semiconductor device manufacturing process is divided into front-end and back-end processes according to the major processes, wafer manufacturing and testing is known as the front-end process, while the chip packaging, testing and warehousing of finished products is known as the back-end process.

According to SEMI statistics, the global semiconductor packaging equipment market is expected to reach $7.8 billion in 2022. Among them, packaging equipment accounts for about 7% of the overall share of semiconductor equipment, belonging to the core process.

Chip packaging mainly refers to the use of film technology and micro-connection technology, semiconductor components and other components in the framework or substrate layout, fixed and connected, lead out terminals, and through the plastic insulating medium potting fixed, constituting the overall main structure of the process. Encapsulated semiconductor devices can work in higher temperature environments and resist physical damage and chemical corrosion. Encapsulation provides semiconductor devices with improved performance and durability, as well as easier transportation and installation.

The traditional packaging process can be roughly divided into eight major steps such as backside thinning, wafer cutting, wafer mounting, lead bonding, plastic sealing, laser printing, rib cutting and molding, and finished product testing, etc. In this process, a wide range of equipment needs to be used, such as die cutter, grinding, polishing machine, cleaning machine, bonder machine, inline micro-welding machine, solder paste spraying machine, dispensing machine, temperature control equipment, and appearance testing equipment and so on.

One of the Die bonding machine is a very important part of the semiconductor packaging process, its main role is to bare chip (die) assembly to the Substrate, through the application of high temperature and high pressure, so that the chip and the package substrate firmly combined to form a reliable electrical and mechanical connection. This combination is usually carried out using metal wires or solder balls to ensure good conductivity and reliability. The operating accuracy and stability of the die bonding machine is critical to ensure a reliable connection between the chip and the package.

Die bonding equipment can be subdivided into IC die bonding machines and discrete device die bonding machines, which are widely used in optoelectronic devices, memory devices, logic devices, microprocessors and other fields. IC die bonding machine is more focused on small-size precision requirements, the development of more difficult, lower localization rate.

At present, Suzhou Bozhon Semiconductor Co., Ltd. MicroStar series of eutectic die bonding machines and FastStar series of epoxy die bonding machines are for optical chip and IC chip placement of high-precision placement equipment.

MicroStar series automatic high-precision eutectic die bonding machine is applied to optical chip packaging high-end equipment, high precision of ± 0.5μm - ± 3μm, both eutectic patch, dip glue patch function, can be applied to COC, COB, COS, and other packaging processes, through the use of nanometer absolute value of the double-feedback gantry structure, multi-tip (12) dynamic automatic replacement, multi-transfer station (8), 2x2" / 4x4" gel pack/waffle pack and cartridge buffer automatic loading and unloading methods, together with a full-featured and easy-to-operate software, to meet the customer's rapid mass production and high productivity needs.

Suzhou Bozhon Semiconductor—MicroStar Series Eutectic Die Bonding Machine

    FastStar series high-speed and high-precision epoxy die bonding machine is a high-speed and high-precision equipment for multi-chip packaging, which can realize up to 7000pcs/h placement efficiency (depending on the process) under the condition of ±10μm@3σ accuracy. Adopting open architecture and modular design, it provides on-demand customization capability with extreme efficiency, can handle 12" wafers (Max), and is compatible with various substrate transfer methods to meet solid crystal, Flip chip, SiP and other packaging processes. Mainly applicable to ESD, MOS and third generation semiconductor SiC, GaN devices.

Suzhou Bozhon Semiconductor—FastStar Series Epoxy Die Bonding Machine

In conclusion, the die bonding machine plays a key role in the chip encapsulation process by ensuring a strong connection between the chip and the encapsulated substrate or carrier through high-precision positioning and alignment, as well as a reliable joining process, providing high-quality and reliable encapsulation results.