Introduction：Bozhon Semiconductor EH9722 is compatible with CoC/CoB/COS/BOX and other packaging forms, which helps 400G-1.6T optical modules to quickly develop to mass production.

9/20/2024, Fiber Optics Online, With the release of the 2023 Generative Artificial Intelligence (AI) large language model, the rapid development of AI applications has led to the urgent need for AI arithmetic, which in turn has spawned the rapid growth of the high-speed optical module market. Against this backdrop, Bozhon Semiconductor, as a leader in automation equipment that facilitates the R&D and mass production of high-speed optical modules, has launched an innovative platform-type eutectic machine, EH9722, which is compatible with various packaging forms, such as COC (Chip on Carrier), COB (Chip on Board), COS (Chip on Substrate), and Box (Box) packages, and has been widely adopted by the industry. The device is compatible with COC (Chip on Carrier), COB (Chip on Board), COS (Chip on Substrate), and BOX (Box) packaging forms, and supports eutectic placement, adhesive-dipped placement, and Flip Chip placement processes, which are designed to accelerate product specification development in the R&D and mass production phases.

Recently, Fiber Optics Online interviewed Mr. Fu Jiangbo, R&D Director of Bozhon Semiconductor, to discuss the background of the development of this innovative device and the future trend of high-speed optical module technology.

AI arithmetic is still full of opportunities, rapid R&D and mass production are crucial. With the rapid development of global high-speed optical interconnect technology, there is a growing demand for optical modules of a few meters to 10km applied in data centers, which requires optical module manufacturers to be able to quickly develop samples and mass production. With more than 20 years of technology accumulation and professional experience in the field of automation equipments, Boxer Semiconductor has launched the MicroStar EH9722 series, which is a multi-functional die bonding equipment with high precision and high efficiency. It is not only suitable for full-featured rapid prototyping at the R&D stage, but also for single or multiple packaging process platforms for mass production. It supports 400G, 800G, and 1.6T optical module scenarios, and is equipped with eutectic placement, adhesive-dipped placement, and Flip Chip placement functions to satisfy the demand for multi-chip placement. Its modular design and intelligent calibration and data management system provide strong support for highly flexible manufacturing and process traceability, and it has won the favor of industry giants upon launch.

Mr. Fu Jiangbo pointed out that the market time window for optical interconnect demand brought about by AI arithmetic is about 3-5 years. Therefore, for the optical module market, which is constantly and rapidly iterating, the efficiency and precision of patching is the primary focus of customers, and the MicroStar EH9722 is designed to address this challenge. With optical module customers focusing on the development of 1.6T optical module products and the diversification of SiP, EML, VCSEL and other technology solutions, the precision and speed of the eutectic placement equipment has become the key to the mass production of this product and high efficiency production and manufacturing. Although the current industry generally adopts 3um placement accuracy, customers expect to further improve to 1.5um accuracy, and the placement efficiency should reach 1,000 pieces/hour. Bozhon Semiconductor's eutectic equipment in the eutectic heating COC process has been able to meet customer demand, but in the conductive adhesive COB process production efficiency, the company is still optimizing, and strive to plan and develop products that create higher value for customers.

CPO technology fits the trend of advanced packaging

In response to the next step towards CPO packaging, Bozhon Semiconductor how to deal with. Mr. Fu pointed out that: with the development of optical modules to 1.6T and above, the integration and power consumption of traditional pluggable optical modules have become more prominent, CPO (co-packaging of optoelectronics) is a better solution for optical interconnection, which puts forward higher requirements for the precision of the placement equipment, CPO tends to be in the direction of advanced packaging, which is compatible with the long-term development strategy of Bozhon Semiconductor. At the same time, the realization of CPO will also change the packaging and process of optical and electrical chips, which means that the packaging equipment needs to have higher precision and better co-optimization ability, which is both a challenge and an opportunity for equipment manufacturers because it promotes the progress and innovation of technology.

In the competition for localized packaging equipment, Fu believes that the fierce competition reflects the huge demand and attractiveness of the optical communication market. Bozhon Semiconductor's strength lies in its more than 20 years of focused experience in automated packaging equipment, especially its deep accumulation in areas such as motion control. The company's core components, such as linear motors and actuators, are custom-developed based on Bozhon's platform, which facilitates rapid implementation of innovative automation designs. As optical communication develops to higher precision and tends to semiconductor manufacturing, the rich automation production experience accumulated by Bozhon in the 3C field and the resources in the semiconductor field will help the company make more progress in the advanced packaging field.