Abstract: In the next 2 years, optical communications, optoelectronics, high-power laser and LIDAR and other fields will usher in a round of new growth,, automated packaging equipment has good visibility of development, BoZhon Semiconductor will continue to play its own technical advantages, and the industry chain of upstream and downstream extensive cooperation, to help semiconductor, optoelectronics, optical module industry, the innovation and high-quality development.

During September 11-13, CIOE 2024 was held in Shenzhen International Convention and Exhibition Center. High-precision automation equipment provider Suzhou Bozhon Semiconductor Co., Ltd. made a wonderful appearance at the exhibition with the full series of MicroStar products and the heavyweight new product EH9722 eutectic die bonder. The company sent technical and market experts to discuss the latest development technology and industry trends in the field of optical communication with the professional audience on the spot, and the popularity of the booth was soaring, and the display of the products and solutions were widely noticed and praised.

Liu Jinbao, marketing director of Bozhon Semiconductor, was interviewed by Xun Shi Optical Communication Network, saying that the key product of this year's CIOE exhibition is the newly released EH9722 eutectic die bonder, which has an All in one integrated solution, and can be equipped with a variety of mounters such as eutectic, dipping, dispensing, UV curing, etc., based on the guarantee of ±3um mounters' accuracy, and can be used to work at two stations to improve the mounters' efficiency. It is suitable for COC/COB/COS/Gold-box placement of high-speed optical devices. In the AI model to promote 400G/800G optical module demand explosion and 1.6T module into the pre-commercial stage, high-precision, automated, modular chip placement equipment is to ensure the reliability and consistency of high-speed optical modules of the key equipment, and the Bozhon Semiconductor in the high-precision placement process, the full stack of self-research and flexible response service for optical communications customers to provide differentiated competitiveness in the market.

Today, AI big model applications stimulate the growth of 400G/800G and 1.6T datacom optical module market demand, Cignal AI points out that the global high-speed datacom optical module market shipped more than 3 million units in the first quarter of 2024, and the large-scale network operators pushed the purchase of 400GbE/800GbE datacom optical modules and 400ZR telecom optical modules to a new record high, and the LightCounting also reported Q2 2024 optical module sales of more than $3 billion, a new single-quarter record, and Yole forecasts the overall AI-driven optical module market in the digital communications space will grow by more than 45% in 2024. The increasing volume and development prospects of the high-speed optical module market provide room for Bozhon Semiconductor to develop in the optical communication market.

How does the company present its own competitiveness in the optical module market in response to frequent customized differentiation needs? Liu Jinbao said that with the evolution of optical communications towards 800G/1.6T direction, the precision of optoelectronic device mounting package from the traditional ± 10 to ± 7 μm to the current ± 5 to ± 3 μm high-precision upgrades, this is because the high-speed optical devices are more and more intensive miniaturization, the stability of the chip mounting will affect the subsequent coupling package and the overall device yields, coupled with the existence of differentiated patch for each optical module customer Process, will test the flexibility of automation equipment manufacturers to adapt to the ability. In this regard, Bozhon Semiconductor MicroStar series of eutectic die bonding equipment adopts a modular layout, Bozhon's technical advantages, in the operation and control track, strength control, nozzle parts and other key parts by replacing different modules to achieve flexible configuration. Taking the new EH9722 eutectic bonder as an example, the equipment is equipped with intelligent calibration and data software management system, and self-developed eutectic friction process programming system, which can realize customized friction action, reduce the void rate and improve the surface wetting conditions. In addition, its deep cavity placement depth can reach 17mm, and the self-developed high-definition display process observation system truly realizes real-time monitoring of the whole process, which is more perfectly suited to the application of various placement scenarios for optical modules.

  Modular design concept is a significant feature of Bozhon semiconductor automation equipment, which can bring highly flexible manufacturing capacity, adapt to different standard interfaces, intelligent calibration and platform management of functional modules. For industry benchmark customers, Liu Jinbao said that the company can jointly customers from the hardware and software to start, the exploration of new special process. For a large number of optical module customers and urgent customization requirements, compared with similar foreign automation brands, Bozhon relying on the domestic market in the service response is more rapid, including pre-discussion, intermediate R & D to on-site validation, the company for the diversity of the actual needs of the customer, can support the customization of the customer's configuration, comprehensive coverage includes eutectic chip placement, dipping patch, adhesive patch and Flip Chip placement function, can be flexibly adapted to a variety of chip placement needs. The company can support the customization of customer configurations for the diversity of customers' actual needs.

Liu Jinbao, Marketing Director of Bozhon Semiconductor (left), was interviewed by Xun Shi.

  Looking forward to the next two years, optical communication, optoelectronics, high-power laser and LIDAR and other fields will usher in a round of new growth, the growth trend covers the entire optoelectronic industry chain, automated packaging equipment also has a good visibility of development. New opportunities also come with new challenges, which require continuous innovation and iteration to meet the changing market demands, while Bozhon Semiconductor will continue to utilize its own technological advantages and cooperate extensively with the upstream and downstream of the industry chain to help the semiconductor, optoelectronics, and optical module industries to develop in an innovative and high-quality way.