Recently, Suzhou Science and Technology Bureau officially announced the list of Suzhou Innovation Consortium in 2024, in which ‘Suzhou Semiconductor 2.5D/3D Packaging Key Technology and Core Equipment Innovation Consortium’ led by Bozhon Precision Industry stood out and was included in the list of directive projects, which marks the project has gained further recognition in promoting semiconductor industry technology innovation and independent control. The project was included in the list of directive projects, marking the project's further recognition in promoting the semiconductor industry's technological innovation and self-control.

The selected ‘Suzhou Semiconductor 2.5D/3D Packaging Key Technology and Core Equipment Innovation Consortium’ is formed by Bozhon Precision Technology Co., Ltd. as the core force, together with Soochow University, Harbin Institute of Technology and other 12 enterprises and institutions. The consortium focuses on independent research and development of core components in the field of semiconductor packaging and testing, aiming at building a leading domestic key technology platform for semiconductor 2.5D/3D packaging equipment through interdisciplinary and cross-field collaborative innovation, and contributing to cracking the monopoly of foreign technology and enhancing the competitiveness of China's high-end equipment manufacturing industry.

Bozhon Precision is one of the leading intelligent manufacturing solution providers in China, with deep technical accumulation and rich market experience in the field of semiconductor equipment manufacturing, the company continues to carry out innovative R & D, high-speed and high-precision placement, AOI inspection of the two technical fields continue to plough, mainly dedicated to the research and development, production and sales of high-precision solid crystal and eutectic equipment, as well as AOI optical inspection equipment. The establishment of the innovation consortium will effectively integrate the upstream and downstream resources of the industry chain, promote the deep integration of industry, academia and research, and provide strong support for technological innovation and industrial upgrading in the field of semiconductor packaging and testing.

Suzhou, as an important national science and technology innovation highland, has been increasing its support for the innovation consortium in recent years to promote innovation elements to achieve spatial agglomeration and synergy in action. The semiconductor project led by Bozhon Precision Industry was successfully selected in the list of Suzhou Innovation Consortium directive projects, which is not only a high recognition of Bozhong Precision Industry and the consortium members' technological strength and innovation ability, but also an important initiative to accelerate the construction of Suzhou's technological innovation system which is enterprise-driven, market-orientated, and deeply integrated with industry, academia and research.

In the future, with the in-depth implementation of the project and continue to promote, Suzhou Semiconductor 2.5D/3D packaging key technologies and core equipment innovation consortium will continue to promote China's semiconductor packaging and testing in the field of technological innovation and industrial upgrading, and for the development of China's high-end equipment manufacturing industry to inject new momentum.