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Interview with Yu Song (General Manager of BOZHON Semiconductor Co., Ltd.): Achieving Fully Automate
2023-06-14
Recently, XUNSHI Optical Communication Network visited and interviewed BOZHON Suzhou headquarters to communicate. BOZHON provides fully automatic highprecision eutectic machine which stably achieve high efficiency operations of ±0.5μm ~ ±3μm multifunctional chip placement. In response to the demand from customers in optical communication and semiconductor areas of manufacturing with high precision, high stability, low cost, and high efficiency, BOZHON provides domestic automatic high-precision chip placement, AOI inspection and other intelligent equipment.
ICC News Recently, XUNSHI Optical Communication Network visited the headquarters of BOZHON Precision Industry Technology Co., Ltd. In Suzhou. With the continuous development of Internet traffic, cloud data center and high-performance computing, the capacity performance and port density of switches and routers continue to be optimized, and optical devices are also evolving to high speed, high density, high integration, and miniaturization.
The next generation of optoelectronic chip packaging is very different from traditional packaging, which brings great challenges to automated chip placement. Yu Song, vice president of BOZHON Precision and general manager of Suzhou BOZHON Semiconductor Co., Ltd, was interviewed by XUNSHI, said that BOZHON Precision was established in 2001 and has a 400,000-square-meter R&D and production base, with business layout in consumer electronics, automotive parts, lithium equipment, semiconductor packaging equipment, opticalgrade motion control key components and other fields. Among them, the main business of semiconductor packaging equipment segment BOZHON Semiconductor, established in 2022, relies on BOZHON Precision Technology's more than 20 years of technology in the field of automation manufacturing, based on the semiconductor, to provide leading and stable advanced process and testing equipment for global customers. The birth of BOZHON Semiconductor is in response to the national strategy of "localization and replacement of semiconductor equipment", which helps to promote the iterative upgrading and development of advanced processes in China's semiconductor industry.
This year, OpenAI has taken the world by storm with an AI (artificial intelligence) application ChatGPT, opening the curtain of the world AI era. NVIDIA released the latest GH200 Grace Hopper super chip and DGX GH200 supercomputer system to support the development of a richer AI industry with its powerful arithmetic performance and communication hardware. In addition to traditional cloud service demand, AI arithmetic demand is becoming a new growth driver for the optical communication technology industry. 800G optical modules and optoelectronic devices, as one of the core hardware for AI arithmetic performance, are gradually surpassing industry expectations in terms of market demand, and the optical communication technology industry is in the early stage of a massive outbreak of AI demand, which is expected to usher in a new round of incremental market. Compared with traditional products, optical modules and optoelectronic devices in the 400G/800G era will face more stringent challenges in terms of production efficiency and cost reduction, and the technical process of highend products will also lead to differences and diversification due to the customization needs of each manufacturer. More critically, most of the highend optical module internal core laser chip placement accuracy control only allows ± 3μm between, for the latter device coupling process to provide sufficient, stable alignment error space. This requires enterprises to rely on more advanced automation, flexibility, high-precision production methods, while this way and because of foreign monopoly and high prices, making optical communication enterprises face huge cost pressure. Yu Song said, as a semiconductor equipment research and development manufacturer, BOZHON Semiconductor is committed to become a leader in China's optical communication and semiconductor industry, through micron-level, sub-micron-level, nano level technology development and product innovation, to help users upgrade automation. The company targets the window opportunity of 800G/1.6T switching in optical communication industry and the trend of localization of highend automation equipment replacement in semiconductor industry, and provides localized automatic highprecision chip placement, AOI inspection and other intelligent equipment for optical communication and semiconductor customers' demand characteristics of high precision, high stability, low cost, and high efficiency manufacturing.
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MicroStar Series Automatic High Precision Soldering Machine Die Bonding
BOZHON Semiconductor officially announced the mass production of DB3000 automatic high-precision eutectic mounter at the end of 2022, which is an important milestone of BOZHON’s development in the field of optical communication and semiconductor. This equipment can maintain a stable placement accuracy interval of ±3μm, which is suitable for 5G and data communications, lasers, power semiconductors, MEMS, sensors, RF devices and other products that require high-precision technology packaging process, to meet the needs of high-end 400G, 800G optical communication devices and chips for flexible automated packaging, and also to a certain extent to break the monopoly of foreign countries in the field of high-end placement equipment, to achieve It has also broken the monopoly of foreign countries in the field of high-end placement equipment to a certain extent and realized the localization replacement. Yu Song introduced to XUNSHI, with more than half a year of continuous research and development, the automatic high-precision eutectic machine has been technically updated and extended to the full range of products, including EF8621, EF9621, EH9721, EF7921, EG9921, is the efficiency and precision of the leading multifunctional chip placement equipment. It is a multi-functional chip mounting equipment with leading efficiency and precision, which can be used by users to choose different mounting processes such as eutectic, glue dipping and Flip Chip to complete multichip mounting, and the accuracy can be chosen from ±0.5μm to ±3μm according to the demand, which can meet the actual production line environment and R&D innovation demand of different users with flexible manufacturing. In addition, BOZHON Semiconductor has also launched the CesiStar series AOI inspection machine, FastStar series high-speed high precision Die Bonder machine and PowerStar series Wafer Cleaning system, which are designed to meet the strict control of product quality in optical communication and semiconductor industry. With a large number of products used in highly automated assembly lines of consumer electronics, automotive parts and other typical manufacturing industries, BOZHON Precision has accumulated a lot of experience in engineering development and core technology development, and its innovative ability in three aspects, namely product, market and process, can fully empower BOZHON Semiconductor's product development and market competition. In terms of product innovation, the company has accumulated rich experience in the design, process, and production technology of semiconductor process equipment, which enables the automatic highprecision eutectic machine to operate at ±3μm mounting accuracy and 2g force control accuracy for a long time, and the technical index and stability of the equipment are at the same level with foreign countries. In terms of market innovation, the company insists on the driving force of "productoriented by market demand", focuses on the research and development of semiconductor process equipment, and promotes product development innovation. In the early stage of product development, we ensure the reliability of the equipment through simulation technology and various testing methods, and the performance parameters are closely matched with the market demand, which has established a strong competitive advantage in the industry. In addition, in process innovation, BOZHON Semiconductor has an integrated layout of design, simulation, process, production line integration and experimental verification. Through process base limits and optimized process modules, we effectively improve the delivery quality and output efficiency of the devices.
Yu Song Vice President of BOZHON Precision, General Manager of Suzhou BOZHON Semiconductor Co., Ltd
The consumer electronics industry is a classic application for automation equipment, and global tier-one giants such as Apple, Samsung and Huawei have led the development of the consumer electronics industry, effectively working together with supply chain manufacturers to drive industry progress. BOZHON Semiconductor expects to bring the cooperation concept and service of global top companies to the optical communication and semiconductor industry, and create value for users' custom development. Under the trend of AI, cloud computing, dual-gigabit, and all-optical network 2.0 industry, BOZHON Semiconductor is looking forward to a more open ecological construction, joint development, and close integration with industry partners to realize the technological progress of optical communication and semiconductor industry.
