According to Fiber Optical Online News, during this year's CFCF Optical Connectivity Conference, Fiber Optic Online visited the headquarters of BOZHON Precision Industry Technology Co., Ltd. and interviewed this core technology provider of intelligent manufacturing equipment. Mr. Yu Song, Vice President of BOZHON Precision Industry and also the General Manager of BOZHON Semiconductor, accepted this interview with Fiber Optic Online, introducing BOZHON’s business strategy layout and sharing how BOZHON Semiconductor can help semiconductor and optical communication optoelectronic device packaging with better solutions.

BOZHON Precision Industry Technology Co., Ltd(Stock Code: 688097) was established in 2001, with a R&D center and production base of 400,000 square meters, it focuses on industrial equipment manufacturing fields including digital equipment fields, consumer electronics, digital new energy, high-end equipment, semiconductors, key components, and intelligent warehousing and logistics.

BOZHON Semiconductor was established in 2022, relying on more than 20 years of experiences of manufacturing of BOZHON, is committed to become a leader in China's semiconductor industry, through micron-level, sub-micron-level and nano-level technology development and product innovation, to promote the development of advanced semiconductor processes and industrial upgrading by constantly providing cutting-edge products to the industry.

Yu Song with Tang Rui (Analyst of Fiber Optical Online)

Breaking Industry Boundaries with Advanced Packaging to Help HighQuality Optical Communication Industry Development

Yu Song introduced, BOZHON has invested a great amount of financial resources and efforts in many fields of equipment manufacturing in the past, and has achieved technological breakthroughs by innovations. The establishment of BOZHON Semiconductor is the first step of BOZHON in the field of semiconductor equipment, relying on the experience of BOZHON in the digital factory, to focus on four key stages of packaging and testing: the eutectic, die bonder, AOI, and wafer cleaning, which helps customers to achieve stable production during their manufacturing process.

Under the current trend of advanced packaging and optoelectronics, Yu Song believes that firstly the future market will certainly break the boundaries of the industry to achieve multi-material heterogeneous integration, resulting in more efficient and multi-functional materials, devices, systems, and equipment. Secondly, the current market in optoelectronic technology platform would tend to converge, and the advanced packaging would likely to become the key to surpass Moore's Law and improve chip. Third, the demand for non-standard automation, mechanical design, electrical and automation control, algorithms, measurement, and control, etc. would achieve multidimensional uses and combinations. At the same time, under the shift of current global industry chain and the change of its pattern, customers would switch to excellent domestic equipment suppliers, providing more opportunities to suppliers like BOZHON Semiconductor.

BOZHON Semiconductor would take the optical communication industry as its entry point for 2.5D/3D advanced packaging, accelerating the optical communication companies from aspects such as process stability, efficiency, and precision. For example, the fully automatic high-precision eutectic machine series, which officially launched in 2022, is a multifunctional eutectic device with leading efficiency (15-35s/pcs) and precision (0.5-3μm). It can achieve eutectic bonder, glue dipped bonder and Flip Chip function with sub-micron level accuracy and can support 8 kinds of products in common line production. It is the first choice for optical communication companies for their next generation of higher speed and higher density 4 or 8way 400G/800G/1.6T placement process. Also, this series can be applied to fields such as high-power lasers and LIDAR.

The Breakthrough Path of Domestic high-end Equipment from the Process

Recently, the localization of highend equipment to promote industrial transformation and upgrading has become the main trend of China's manufacturing industry. While being asked about the current gap of the localization of optoelectronic chip packaging and die bonder equipment, Yu Song stated that it is mainly depending on the understanding of the process and the concept of down-to-earth, and only the replacement and low sales price is not desirable.

Firstly, and from the view of concept, what we want is the understanding of the process and long-term research, while the disconnect of process and equipment and weak research and development abilities restrict it badly. Of course, this requires time to accumulate, as well as long-term investment. In addition, the ability to multi-task and breakthroughs in the core process of innovation are crucial, which requires upgrading in mechanical design, motion, vision, algorithms, sensing and other aspects. Thirdly, the domestic brand is still lack of customer recognition from the quality and performance. However, technical indicators of domestic and international equipment are equivalent. This requires the joint efforts of the whole industry chain to gain enough trusts.

Looking ahead, Mr. Yu said, BOZHON Semiconductor would take automation as the base, deepen the domestic highend equipment manufacturing, improve the customer's process line stability with technological innovation, both software and hardware in parallel, with a deep understanding of the process and repeated verification to keep up with the changes in customer's technical needs. Simultaneously, BOZHON Semiconductor would continue to deepen the synergistic cooperation with the upstream and downstream of the industry chain to jointly promote the sustainable development of optical communication and semiconductor industry.