On June 7 CFCF2023 Optical Connection Conference It ended successfully in Suzhou.
The CFCF Optical Connectivity Conference is based on the construction of optical network infrastructure, based on optical devices, optical modules, and optoelectronic chip enterprises, and linked with upstream and downstream enterprises of the optical communication industry chain, industry scholars and experts to jointly exchange current technological progress and market direction, and discuss Pain points and evolution direction of nextgeneration optical communication technology and optoelectronic interconnection solutions in more application fields.
As the leading domestic Semiconductor process and testing equipment supplier ， Suzhou BOZHON Semiconductor Co., Ltd Marketing Director, Zhang Genfu was invited to attend this thematic summit and made a presentation at the theme forum of "Data Center Optical Interconnection" Co exploration Optoelectronic Packaging Equipment and Process The keynote speech of.We shared with the audience how BOZHON Semiconductor can better empower the end users and partners in the optoelectronic field through upgrading its technology products in the context of the rise of optoelectronic information technology.
Zhang Genfu mentioned in his speech that with the implementation of a large number of specific applications such as intelligent driving, artificial intelligence and big data, optoelectronic information technology is rising rapidly. At the same time, the requirements for devices with large bandwidth, small size, high density and low power consumption, as well as the delivery requirements for small batch, multi batch and rapid mass production Device manufacturer delivery brings greater difficulty .
Facing the new features and challenges of optical chip packaging, Suzhou Bozhong Semiconductor launched MicroStar Series-Fully Automatic High Precision Soldering Machine， Accuracy can reach 0.5μm~10μm 。 It can realize the functions of eutectic patch, dip patch and Flip Chip to meet customers' requirements for multi chip mounting.The modular design concept enables it to have a highly flexible manufacturing capability. It is equipped with an intelligent calibration and data management system, which enables it to have the ability to trace and manage processes, and has the characteristics of high-precision, high-capacity, and highly flexible products.
· The precision of glass patch is better than ± 2μm@3σ，The mounting accuracy of actual materials (part) is better than ± 3μm@3σ· Force control: 15g~100g range accuracy is better than ± 2g, and the minimum force control can be as low as 10g· Temperature control: the temperature rise overshoot is better than plus or minus 1 ℃, and the temperature error in the insulation area is less than plus or minus 1 ℃· Double eutectic stage, greatly improving equipment efficiency, and the time of a single eutectic patch can be less than 15 seconds· Rapid temperature rise and drop, the maximum temperature rise rate is more than 80 ℃/S, and the patch process time can be greatly shortened· Change the nozzle in flight, greatly reducing the switching time of changing the nozzle· It supports dipping function, multiple nozzles and multiple transfer stations, which can realize multiple material patches at a time· Multiple loading and unloading methods, including blue film, waffle disk, etc· Vision system and operating software can be programmed independently and flexibly 
BOZHON Semiconductor is committed to providing global customers with leading and stable advanced processes and testing equipment.In the future, innovation and R&D will continue Breaking technical barriers , constantly improve the performance of the product, and With enterprises in the industry trade Build a win cooperation ecosystem to help the rapid development of optoelectronic industry.
