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Traditional Packaging and Advanced Packaging: Comparison and Outlook
2024-01-08
With the rapid development of technology, integrated circuits (ICs) have become the core of modern electronic devices. However, effectively integrating these small and complex chips together while maintaining their functionality is an important challenge in the field of technology. Packaging technology is a key link in solving this challenge. Traditional packaging and advanced packaging are two main packaging forms, each with its own characteristics and application areas.
Traditional packaging is a process that typically involves cutting the original chip into individual chips before packaging. Its main purpose is to protect the chip from the influence of physical and chemical environments, and to help connect the chip with external circuits. Mainly including DIP, SOP, TO, LCC, QFP, WB BGA and other packaging forms. Advanced packaging refers to the most cutting-edge packaging forms and technologies, mainly including Flip Chip, wafer level packaging (WLP), 2.5D packaging (Interposer), 3D packaging (TSV), SiP (System in Package), Chip let, etc.
Advantages and disadvantages of traditional packaging
Advantages:
1. Mature technology: After years of development, traditional packaging technology has become very mature.
2. Low cost: Due to mature technology and large production scale, the cost is relatively low.
3. High reliability: Traditional packaging has good sealing and provides reliable protection for chips.
Disadvantages:
1. Large packaging volume: Traditional packaging has a larger volume, which is not conducive to miniaturization and lightweight.
2. Limited electrical and thermal performance: Traditional packaging has relatively poor electrical and thermal performance.
3. Unable to meet high-end application requirements: Traditional packaging is difficult to meet the needs of high-performance and highly integrated chips.
Advantages and disadvantages of advanced packaging:
Advantages:
1. Size miniaturization: Advanced packaging can make the chip size smaller, which is conducive to achieving miniaturization and lightweighting of electronic products.
2. High performance: Advanced packaging can improve the electrical and thermal performance of chips, meeting the needs of high performance and high integration.
3. High reliability: Advanced materials and technologies are used to enhance the sealing, durability, and reliability of advanced packaging.
4. Low cost: Although advanced packaging has higher manufacturing costs, it can reduce the overall system cost due to its improved chip integration and performance.
Disadvantages:
1. High manufacturing technology difficulty: Advanced packaging involves high technical complexity and manufacturing difficulty.
2. High cost: The manufacturing cost of advanced packaging is high, which limits its application scope.
Traditional packaging is relatively simple in technology, mainly packaging chips on circuit boards in a flat manner. In contrast, advanced packaging is more three-dimensional, and through the stacking of chips, several chips can share a common casing, thereby improving the integration of the circuit. This technology can reduce power consumption and improve performance. Its main characteristics are as follows: 1. It does not use traditional packaging techniques, such as: no bonding wire; 2. High packaging integration and small packaging volume; 3. Short internal interconnection leads to improved system performance. 4. Integrating more functional units per unit volume effectively enhances system performance.
Traditional packaging technology is mature and cost-effective, so it is still widely used in fields that are cost sensitive or have low performance requirements. Advanced packaging, due to its high performance and integration, is widely used in various chips and downstream high end applications, including artificial intelligence, intelligent driving, AR/VR, HPC, LOT, 5G, mobile communication, blockchain, etc. Application chips include CPU/GPU, APU, DPU, MCU, ASIC, FPGA, storage, sensors, analog chips, optoelectronics, etc.
Overall, there are significant differences between traditional packaging and advanced packaging in terms of technical characteristics, functionality and performance, application areas, and development prospects. Traditional packaging technology is mature and cost
effective, mainly applied in fields that are cost sensitive or have low performance requirements; Advanced packaging, by improving the integration and performance of chips, meets the needs of high-end electronic products and provides new possibilities for continuing Moore's Law. In the future, with the advancement of technology and the growth of market demand, advanced packaging is expected to become the mainstream packaging form. In order to adapt to this trend, the packaging industry needs to continuously innovate and upgrade its technology to provide more reliable and high-performance packaging solutions.
