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In-depth analysis: technology and challenges of chip appearance defect inspection machine
2023-12-04
In the process of chip manufacturing, it is very important to inspect each chip in order to ensure the quality and precision of the product. Full inspection by testing equipment can ensure that the appearance, size and completeness of each chip meets the requirements, thus improving the overall quality of the product. In the current industrial market, there are many varieties of chips, and different chip types are packaged in completely different ways. And with the continuous reduction of chip area and package area, as well as the increase in the number of pins and the reduction of pin spacing, the detection of defects in chip appearance has become more and more challenging.
Working Principle of Chip Appearance Defect Inspection Equipment
The working principle of chip appearance defect detection equipment is to utilize machine vision technology, through high-precision image acquisition and processing, to carry out fast and accurate defect detection on the chip surface. Specifically, the working principle of chip appearance defect detection equipment can be divided into the following steps:
1. Image acquisition: using high-precision cameras and lenses, the chip surface is converted into digital image signals, and transmitted and processed. This step is the basis of the entire detection process, ensuring the accuracy of the subsequent processing.
2. Image Processing: Through dedicated image processing software, the acquired image is subjected to various operations and analysis to extract the characteristics of the target. This includes operations such as contrast adjustment, filtering, and edge detection to highlight defects on the chip surface.
3. Defect detection: detect and classify defects on the chip surface according to preset defect detection rules and algorithms. This involves techniques such as pattern recognition and image segmentation to achieve automated defect recognition.
4. Data Output: The inspection results are output as a data report or visualization interface for subsequent analysis and processing. In this way, users can visualize the inspection results and perform further operations as needed.
AOI chip appearance defects inspection equipment structure
Different chip appearance defect inspection equipment can be used for different types of defects and inspection needs to improve the quality and reliability of chip manufacturing.The structure of AOI optical chip appearance defect inspection equipment is a multidisciplinary and complex system that integrates mechanics, automation, optics, and software to efficiently carry out automated optical inspection tasks.AOI optical inspection equipment can be divided into the following main parts The following main parts:
1, hardware system: including servo motors, guide rails, screws, cameras, CCDs, light sources, main control computer and other hardware components. Servo motors are used to drive the entire device for precise movement, guide rails and screws help to realize this movement. The camera is used to capture and record an image of the object to be inspected, and the CCD is an image sensor that converts the optical image into a digital signal. The light source provides illumination to help the camera to shoot clear images, the main control computer is the control center of the entire device, responsible for processing and storing the collected data.
2, software system: AOI inspection equipment software system generally includes image processing system and electrical system. Image processing system is responsible for processing and analyzing the image data obtained from the camera and other equipment, feature extraction and template comparison and other operations to determine whether the object to be inspected for defects. The electrical system is responsible for controlling the operation of the hardware components, such as starting the motor, controlling the lighting and so on.
3, structural framework: AOI inspection equipment is usually a strong and stable structural framework to carry all the hardware components and software systems. This frame not only needs to have sufficient strength and stability, but also need to take into account the convenience of equipment transportation, installation and maintenance.
At present, many manufacturers at home and abroad have introduced AOI inspection equipment, Suzhou Bozhong Semiconductor as a domestic for the whole machine. It provides comprehensive 6-side inspection and 2D/3D measurement for a variety of packaged chips such as BGA, LGA, QFN, QFP, etc. to ensure the quality of the final chip package appearance and yield improvement.
Compared with the traditional 2D AOI, 3D AOI technology is able to perform stereo visual inspection of electronic products in a fast and accurate way by carrying a specialized 3D sensor and camera system. It can capture three-dimensional structure and appearance information to realize all-round inspection of chips or other electronic parts.
With the continuous development of science and technology, the algorithms and software of the chip appearance defect detection equipment are constantly optimized and upgraded to meet the detection needs of various new types of defects. Through continuous research and practice, the sensitivity and reliability of the defect detection equipment has been significantly improved, and it can better detect and classify a variety of tiny defects and potential problems. This is of great significance for improving the quality and reliability of chip manufacturing, and also provides strong support for quality control in the production process.
