High precision eutectic technology is an advanced process which has attracted much attention in the field of electronic manufacturing. In today's industrial environment, in order to meet the demand for high output and high precision, highly flexible automatic mounting equipment has become indispensable.

What is eutectic Mounter?

The highprecision eutectic die attach machine uses the principle of eutectic welding to weld the chip and the solder joint on the substrate. In the welding process, it is necessary to preheat the solder joints on the chip and the substrate, then use the manipulator to suck the chip and place it on the substrate, and then realize eutectic welding by controlling the movement and temperature of the manipulator.

The full-automatic high-precision eutectic Mounter can complete multi-chip eutectic mountings in a single process, and the placement of chips and substrates is mechanized, which makes the automatic Mounter process more efficient than manual. At the same time, the advanced mechanical system and control system can automatically complete the feeding, mounting, testing and other links, greatly improving the production efficiency and product quality. At the same time, it can also avoid errors and cumbersome operations in traditional manual welding, reduce production costs and product prices, and improve market competitiveness.

Bozhon high precision eutectic die bonder

Bozhon semiconductor MicroStar series high-precision eutectic die bonder is a high-precision and high-efficiency multifunctional chip bonding machine. The efficiency of eutectic patch can reach 15~35s/pcs, and the precision of patch is ± 0.5~± 3 μ M. It has the functions of eutectic patch, dip patch and flip chip patch, and is compatible with gel Pak and blue film loading, which can meet the requirements of multi chip mounting. It can provide multi effect and high adaptability system solutions for different application scenarios of various levels of packaging (including COC, cos, cob, to, etc.). The modular design concept enables it to have high flexible manufacturing capability, and it is equipped with intelligent calibration and data management system to enable it to have the ability of process traceability and management.

Technical innovation of Bozhon semiconductor high precision eutectic die bonder

1.High precision Zr linear motor module: This module can not only realize linear motion, but also has the ability of rotary motion, which greatly meets the demanding demand for high-precision force control. Its unique design provides a variety of motion options, making it outstanding in complex working scenes.

2. design of high-precision gantry platform: by using the carefully designed gantry platform, the equipment has achieved excellent high positioning accuracy and high acceleration. This design not only provides excellent stability for the equipment, but also shows excellent performance in high-speed movement and positioning tasks, meeting the dual requirements of equipment accuracy and speed.

3. dynamic tool change design: the unique horizontal turret can be equipped with 12 suction nozzle tools, which can realize the dynamic tool change function and quickly adapt to the replacement requirements of different suction nozzles. This design not only improves the production efficiency, but also reduces the idle time of the equipment, making it more flexible and adaptive.

4. dual wafer workbench design: the dual wafer workbench design is adopted to meet the diversified feeding requirements. This design allows the equipment to handle different types of materials at the same time, improving the versatility and efficiency of the production line.

5. high precision dual field vision calibration system: the introduction of high-precision dual field vision calibration system provides excellent accuracy verification and calibration capabilities for the equipment. This system not only enhances the perception ability of the equipment to the working environment, but also ensures the accuracy of each operation step.

6. design of high-speed cooling eutectic table: the equipment adopts the design of high-speed cooling eutectic table, which effectively improves the operation efficiency of the equipment. This technology can rapidly reduce the temperature, shorten the production cycle, and provide reliable support for the long-term operation of the equipment in high temperature environment.

Bozhon semiconductor high-precision eutectic die bonder is mainly used in high-speed optical communication, optoelectronics and sensing, microwave radio frequency, IGBT power devices, MEMS and other high-precision semiconductor back-end process fields to meet the needs of flexible automatic packaging production of high-end optical communication chips and devices.

With the higher and higher requirements for packaging accuracy and stability, rich experience and perfect process flow have become the key factors for the selection of eutectic Mounter equipment manufacturers. It is expected that in the future, high-precision eutectic die bonder can inject more new vitality into manufacturing.