With the rapid development of science and technology, the semiconductor industry has become an important part of today's society. As an important piece of equipment, eutectic machine plays a key role in improving chip manufacturing efficiency and ensuring chip quality in the chip placement process of semiconductor back-end packaging.

The main principle of semiconductor eutectic machine is eutectic reaction, which refers to the state in which two or more components of substances form a uniform mixture under solid state conditions under a specific ratio. In semiconductor manufacturing, eutectic reactions often occur under specific temperature and pressure conditions, melting and fusing the materials between the chip and the substrate to form a reliable connection.

Features of Semiconductor Eutectic Machine:

High precision: The semiconductor eutectic machine is very precise in temperature and time control, which can ensure the stable progress of the eutectic reaction and the quality of the chip connection.
High efficiency: The semiconductor eutectic machine has a high degree of automation, which can quickly carry out large-scale production and improve the efficiency of chip manufacturing.
Reliability: Since eutectic reactions are carried out under specific temperature and pressure conditions, reliable connections can be formed, improving the stability and reliability of the chip.

Semiconductor eutectic machines are widely used in the chip manufacturing process in the following aspects:
1. The connection between the chip and the substrate: The chip and the substrate can be firmly connected together through the eutectic reaction to ensure the stability and reliability of the chip.
2. Fabrication of chip electrodes: Eutectic reaction can also be used to make chip electrodes, so that signals and power can be stably transmitted between the chip and other devices.
3. Efficient circuit design: Multiple chips and substrates can be connected together through eutectic reactions to achieve more efficient circuit design and improve the flexibility and reliability of circuit design.

From the perspective of the market, China's semiconductor eutectic placement machine market has not yet fully realized domestic substitution. Although China has made some progress in the field of semiconductors, there is still a certain technological gap in high-precision semiconductor eutectic placement machines. As an enterprise focusing on R&D and manufacturing of high-end automation and digital equipment, Suzhou Bozhon Semiconductor has a wide range of product lines and technology accumulation in the field of semiconductor manufacturing. Among them, the eutectic machine is a star product of Bozhon, which is widely used in the back-end packaging process in semiconductor manufacturing.

Bozhon Semiconductor's eutectic machine uses advanced eutectic reaction technology, which can melt and fuse the materials between the chip and the substrate under specific temperature and pressure conditions to form a reliable connection. Compared to traditional soldering processes, eutectic reactions can significantly improve the speed and reliability of the connection while reducing production costs. It has the advantages of high precision, high efficiency and high reliability. It uses advanced temperature control and pressure control technology to precisely control the conditions of the eutectic reaction and ensure the stability and consistency of the connection quality. At the same time, Bozhon Semiconductor's eutectic machine also has the characteristics of high degree of automation and high production efficiency, and can be widely used to meet the needs of large-scale production.

Bozhon Semiconductor has also launched the Xingwei series gantry eutectic machine, which has a lot of highlights, including:
1. Ultra-high lamination accuracy: comprehensive lamination accuracy± 3μ m@3 σ (standard sheet)
2. Ultra-high force control system: pressure control accuracy 10-50g (±3g), 50-300g (±10g)
3. Automatic calibration algorithm: integrated automatic calibration module, the equipment automatically calibrates the accuracy of the system, and reduces manual intervention and debugging
4. Advanced compensation technology: integrated Table-Mapping two-dimensional compensation to ensure the comprehensive accuracy of the equipment

The ultra-high speed aspect is reflected in:
1. Gantry structure design: Gantry structure design to improve the operation efficiency and product compatibility of each axis
2. Advanced operation control system: high-performance ironless motor + carbon fiber structure design, transverse axis acceleration 2.5g/2m, gantry axis acceleration 2g/1.5m
3. High-speed streamline design: Variable speed streamline design saves streamline conveying time
4. Multi-magazine cache design: reduce the frequency of manual loading and unloading

In addition, Bozhon Semiconductor eutectic machine is also equipped with perfect after-sales service and technical support to provide customers with a full range of service guarantees. Whether it is in the equipment installation, debugging or in the process of use of the problem, we can provide timely technical support and solutions to ensure the smooth progress of production.