As we all know, Eutectic die bonding machine and Epoxy die bonding machine are common equipments for semiconductor chip placement process. However, when it comes to the specific processes and applications of these two types of equipment, many people may be confused, or even confuse them, "eutecticdie bonding machine" and "epoxy die bonding machine" can not be distinguished. In fact, after understanding the inner principles and characteristics of these two types of equipment, you can easily identify the significant differences in their processes and applications.

First of all, we first distinguish between "eutectic" and "solid crystal" concept. Eutectic refers to the speific ratio, two or more components of the substance in the solid state conditions to form a homogeneous mixture of the state. In this state, the components dissolve into each other and form a eutectic phase with a specific crystal structure. The formation of eutectics is usually associated with a melting and recrystallisation process in which the raw materials are melted and solidified into crystals with a eutectic structure by means of an appropriate cooling rate. Solid crystals, on the other hand, are generally referred to as epoxy patches (sometimes referred to as epoxy patch bonding), and are the process by which a substance is transformed from a liquid to a solid state. When a substance is cooled below its freezing point, molecules or atoms begin to rearrange and bond together to form crystals with a fixed spatial structure. During solidification, the atoms or molecules are arranged in an orderly fashion and gradually form a lattice. The different shapes and sizes of the lattice determine the morphology and properties of the solid crystal. It can be seen that both eutectic and solid crystals are related to the structure and changes of substances in the solid state, but eutectic emphasises the coexistence of different components, while solid crystals are more focused on the process of phase change of a substance from a liquid to a solid state.

Above by comparing the basic principles of eutectic die bonding machine and epoxy die bonding machine, it is not difficult for us to surmise the main purpose of these two kinds of equipment. Specifically, the eutectic die bonding machine is mainly used for the preparation of alloy materials, by controlling the temperature and composition ratio, so that the alloy in the eutectic temperature under the rapid solidification and the formation of eutectic structure. Epoxy die bonding machine is mainly used for the preparation of crystalline materials, such as single crystals and polycrystals, etc. By controlling the temperature gradient and cooling rate, the material is solidified in an orderly manner to form a crystal structure with a good morphology. In order to better understand and distinguish between these two types of equipment, the next will be from the following several angles to compare the differences between the two.

Chip Eutectic Processes

In terms of application: Eutectic die bonding machine is mainly used for the preparation of alloys, while epoxy die bonding machine is mainly used for the preparation of crystalline materials, such as single crystals and polycrystals.

In terms of control parameters: eutectic die bonding machine controls the temperature and composition ratio to achieve the eutectic solidification of alloys, while epoxy die bonding machine controls the temperature gradient and cooling rate to make the material in an orderly manner solidified into a form with a good crystal structure.

In terms of structural characteristics: eutectic materials solidify rapidly at eutectic temperatures and form eutectic structures, while the atoms or molecules of the materials in the solidification process are arranged in a definite way to form crystals with the same lattice structure.

In the field of application: due to the eutectic alloy materials have special properties and structure, such as high strength, high wear resistance, etc., so the eutectic machine is widely used in aerospace, automotive manufacturing, electronic equipment and other fields. And solid crystal machine is used in the manufacture of optical devices, semiconductor devices, electronic components and other high-precision fields. Among them, single crystal materials have important applications in electronic devices, lasers, optical fibre communications and other fields, while polycrystalline materials are widely used in the preparation and research of metal materials, ceramic materials and so on.

It is worth mentioning that both types of equipment are key equipment for the semiconductor packaging process. Especially with the development of artificial intelligence, cloud computing, Internet of Things and automotive electrification and other industries, the demand for semiconductors is increasing day by day.   At the same time, it also stimulates the development of the semiconductor equipment industry, as the key equipment for completing the back-channel packaging process, semiconductor eutectic die bonding and epoxy die bonding machines play a huge role in the packaging process.

Take the example of bozhon Semiconductor's MicroStar series of automatic high-precision eutectic die bonding machines and FastStar series of high-precision epoxy die bonding machines to elaborate on their main uses.

Bozhon Semiconductor Equipment Series

Suzhou Bozhon Semiconductor Co., Ltd. is committed to becoming the world's leading semiconductor equipment R&D manufacturer to promote the development of China's semiconductor industry. Against the background of the rapid development of the semiconductor and optical communication industries, Bozhon Semiconductor, relying on more than twenty years of technical accumulation, and with its professional experience and R&D capability in the field of automation equipment, focuses on meeting the characteristics of the domestic optical device industry and continues to invest a large amount of R&D resources. They have successfully developed a number of semiconductor equipment product series, including the fully automatic high-precision eutectic die bonding machine of the MicroStar series and the high-speed high-precision epoxy die bonding machine of the FastStar series. These equipment series are mainly applied in the packaging process, providing reliable guarantee for the production of optical devices.

First of all, the MicroStar series of mounters includes five models: EF8621, EF9621, EH9721, EF7921, EG9921, which are multifunctional chip mounters with leading efficiency (eutectic die donding 15-35s/pcs) and precision (0.5-3um), and they are able to achieve eutectic chip bonding, adhesive dipping chip bonding, and Flip Chip functions, which can satisfy the customers' multi-chip bonding needs. The modular design concept enables highly flexible manufacturing capability. At the same time, it is equipped with intelligent calibration and data management system, which makes it capable of process traceability and management.

Bozhon Semiconductor eutectic die bonding machine

In addition, different models of equipment provide differentiated packaging processes to meet the needs of various aspects. The EF8621 achieves even better performance through its dual-head, dual-eutectic soldering table, "zero-time" nozzle conversion system, ultra-fast eutectic soldering temperature rise and fall, and multilevel multifunctional parallel process automation；EF9621 provides multiwafer loading and dynamic ejector changing functions, which is more suitable for multiprocess and multichip production; EH9721 has the functions of rail connection loading and unloading, which is more applicable to a wider range of applications and more suitable for batch production; EF7921 has manual process equipment with submicron placement accuracy; EG9921 is a fully automated submicron placement equipment; and EG9921 is a fully automated submicron placement equipment. EG9921 is a fully automatic sub-micron level placement machine, its unique laser heating can heat the top of the substrate in a small range, to achieve rapid heating of the part surface and rapid cooling effect, and at the same time, can use the pulse heating module designed for multi-chip eutectic soldering.

Secondly, the DU9721 and DW9621 models of the FastStar series are high-speed and high-precision solid state machines for multichip packaging, which can achieve a placement efficiency of up to 12,000pcs/h (depending on the process) under the condition of meeting the accuracy of ±7um@3σ With open architecture and modular design, the DW9621 series can provide on-demand customisation for ultimate efficiency, handle up to 12-inch wafers, and be compatible with a variety of substrate transfer methods to meet the needs of solid-state, MCM, Flip chip, SiP, and other packaging processes. Among them, DW9621 series is a high-speed solidification machine for high-binding force applications. With its self-developed force control system, the machine can achieve the ultimate placement efficiency of up to 500N and 10,000 pcs/h (depending on the process) with a high placement accuracy of ±10um.

Bozhon Semiconductor epoxy die bonding machine

Despite the difference in principle between eutectic die bonding and epoxy die bonding machines, they both play an important role in the field of materials science and engineering, and are widely used in various industries and technical fields. Through the above sharing, do you have a little gain? Welcome to comment and discuss.