On November 15-16, the 2023 World Optical Communication (Suzhou) Innovation and Development Conference, a grand event in the optical communication industry, was successfully held in Suzhou. The theme of this conference is "Optical Communication World · Digital Connected Future", attracting representatives from numerous research institutions, enterprises, and industry associations from the optical communication industry to jointly explore the latest progress and future development trends of optical communication technology.

This conference lasts for two days and has set up sections such as keynote reports, special reports, and application case reports. The attendees conducted in-depth discussions and exchanges around the innovation and development of optical communication industry technology, as well as the application of 5G and the Internet of Things. At the same time, a series of special seminars and technology demonstration activities were held, allowing participants to have a deeper understanding of the latest developments and practical applications of optical communication technology.

As a supplier of optoelectronic chip packaging automation equipment, Suzhou Bozhon Semiconductor Co., Ltd. was invited to attend this conference and set up a booth at the conference to showcase the 800G/1.6T optical module packaging solution to the attendees. Through COB, COC, BOX, TO CAN and other packaging processes, we aim to create an integrated, fully automated, and digital production process that includes chip mounting, bonding, optical coupling, aging testing, and other related processes.

With the continuous expansion of data centers, the bandwidth and speed requirements for optical modules are also constantly increasing. At present, the mainstream optical module speed has reached 400G, and 800G/1.6T technology research and development have been carried out, as well as the commercial application of 800G optical modules. In addition, the integration development trend of optical modules will continue to strengthen. By improving the integration level, the volume and power consumption of optical modules can be significantly reduced, and the performance and stability of optical modules can be improved.

In response to the characteristics of high speed, large bandwidth, low power consumption, and miniaturization of optical modules, Bozhon Semiconductor has launched a fully automatic high-precision eutectic die bonding machine from 0.5 to 3 micrometers in the optoelectronic field, which combines eutectic, dipping, and FlipChip processes. At the same time, it has a dynamic tool changing function and multiple turntables to fully meet the application scenarios of customers with multiple products and processes, achieving a device that meets multiple fitting needs, Maximize equipment utilization and reduce customer operating costs.

△Microstar series fully automatic high-precision eutectic die bonding machine EF8621

△Microstar series fully automatic high-precision eutectic die bonding machine EF9721

In the production of new optical communication devices, Bozhon semiconductor eutectic die bonding equipment not only has high precision, but also has excellent performance and advantages. Its unique horizontal turret mount design allows for the simultaneous operation of 12 different nozzle tools, and enables quick replacement of nozzle tools during movement to minimize conversion time between different materials, processes, and products. This feature enables devices to efficiently and accurately complete mounting tasks when facing different chip sizes and process requirements.

Moreover, in the production process of optical communication devices, the process is complex and requires strict requirements, requiring equipment that can support multi chip and multi process packaging. Bozhon Semiconductor eutectic die bonding equipment has successfully met this demand with its powerful functions and excellent performance. Its high-precision control capability and high-speed mounting technology can ensure the efficiency and quality of large-scale production.

①The high-precision ZR linear motor module can achieve linear+rotational motion and meet the requirements of high-precision force control accuracy;

② High precision gantry platform design to meet the needs of high positioning accuracy and high acceleration of equipment;

③ Dynamic tool changing design can meet the requirements of quick replacement of various suction nozzles;

④ Dual wafer workbench design to meet various material supply needs;

⑤ A high-precision dual field vision calibration system that meets the needs of equipment accuracy verification and calibration.

⑥ High speed cooling eutectic table design can effectively improve equipment efficiency

The World Optical Communication Innovation and Development Conference provides an important platform for cooperation and exchange in the optical communication industry. Through in-depth discussions at this conference, Bozhon Semiconductor will adhere to using technological innovation to improve customer process line stability, practice parallel software and hardware, and keep up with changes in customer technical needs. Looking forward to collaborating with upstream and downstream industries in the new journey to jointly promote the development and application of optical communication technology.