From 30 October to 1 November, 2023 Productronica China   Exhibition was held in Shenzhen International Convention and Exhibition Centre (Baoan New Venue). The exhibition explores the future trends of electronics manufacturing around automation and motion control, test and measurement, surface mounting, dispensing and injection & chemical materials, wire processing, semiconductor packaging and manufacturing, and smart factory.

Suzhou Bozhon Semiconductor Co., Ltd. took the theme of "AI Core Era, Leading the Future of Advanced Packaging" and made a grand appearance with LIDAR packaging solution, 800G/1.6T optical module packaging line solution and power semiconductor digital factory line solution.

Lidar short and medium-term barriers in the optical technology, in the long term, the performance improvement and cost reduction are dependent on the development of semiconductor and photonic integration technology. In the future, with the further popularisation of autonomous driving technology, the LiDAR industry will move towards "low-cost", "lightweight" and "solid-state" development. Bozur Semiconductor's automotive-grade LIDAR packaging solutions utilise TO/COC/COS packaging processes to achieve the high-precision and high-reliability requirements of LIDAR optical chips.

Fully automatic high precision die bonding machine for LIDAR package

As the rate of 800G/1.6T optical module device is getting higher and higher, the requirement of large bandwidth, high density and low power device has brought more challenges to the packaging, Bozhong Semiconductor through COB, BOX, TO CAN and other packaging processes, to create a whole line of optical module packaging solutions that include integration of placement, bonding, optical coupling, aging and testing processes, full process automation and digital production. We are looking forward to the next generation of optical module packaging solutions.

Bozhon Semiconductor combines automation and digitalisation of the production line, using a large number of advanced information technology means to achieve a seamless flow of data between the various management systems, and completes the process flow of sorting, placement, side frame assembly, bonding, potting and curing, testing, and so on.

Bozhon Semiconductor focuses on the technological development and innovation of semiconductor back-channel packaging and inspection equipment, and has successively laid out the M series of automatic high-precision die   machines, cesistar series of AOI inspection machines, FastStar series of high-speed high-precision solid-state machines, and powerStar series of Wafer cleaning system.

Among them, Bozhon Semiconductor MicroStar series of automatic high-precision eutectic machine precision of ± 0.5-3 microns, is for optical modules, semiconductors, high-power lasers and automotive LIDAR and other optoelectronic chip chip chip tailor-made packaging equipment, equipment using advanced operation and control technology and modularity design concepts, so that it has a high degree of flexibility in the manufacturing capacity, the ability to flexibly achieve multi-chip in a single device, multi-process, multi-variety optoelectronic devices mass production. The equipment adopts advanced operation and control technology and modular design concept, which makes it highly flexible and capable of realising multi-chip, multi-process and multi-variety mass production of optoelectronic devices on one equipment. It can meet the requirements of COB, COC, COS, Gold-Box and other packaging forms. Equipped with dynamic tool-changing turret and blue film & Gel-pak loading device, it greatly ensures the high reliability and high efficiency of product placement.

2023 Bozhon Semiconductor's trip to Electronica Munich has come to a perfect end. In the future, Bozhon Semiconductor will continue to closely follow the market demand, technological innovation and upgrading iteration, to provide customers with better equipment and packaging solutions, to promote the development of advanced semiconductor process and industrial upgrading.