From 6-8 Sep, during CIOE 2023, Suzhou Bozhon Semiconductor Co., Ltd, a provider of semiconductor advanced packaging automation equipment, took "800G/1.6T Super Computing Power, Explore AI Future" as the theme of the exhibition, and With the 800G/1.6T optical module packaging line solution and power semiconductor digital factory line solution two core innovations brilliantly appeared in the CIOE China Optical Expo, obtaining the high attention of industry customers.

Yu Song, Vice President of Bozhon Precision and General Manager of Bozhon Semiconductor, was interviewed by Xun Shi Optical Communication Network, and said that Bozhon Precision, as a global automation solution leader, has accumulated a wealth of professional experience in automated manufacturing and operation. Compared with traditional semiconductor equipment companies, Bozhon Semiconductor has full-stack self-research technology capabilities covering the underlying hardware and software of the equipment system, and can provide highly stable and reliable automated packaging equipment and solutions for customers in the fields of optical communications, power semiconductors, high-power lasers, and LIDAR.

Compared with system integrators, Bozhon Semiconductor not only has the ability of self-research and self-production, and has a relative advantage in the advancement of equipment, but also relies on Bozhon Precision's more than 20 years of technological precipitation in the industrial field as well as the depth of cooperation with many global consumer electronics industry's head customers, has accumulated a wealth of experience in the operation of lighthouse factories, and integrates lighthouse factory solutions into the optical communications production process, combining production line automation and Digital combination, and the use of a large number of advanced information technology means, to achieve in the data flow in the various management systems between the seamless docking, including sorting, patch, side frame assembly, bonding, filling curing, testing and other processes, to help the production workshop in the field of optical communications to improve energy efficiency and reduce production costs.

Speaking to XUNSHI, Yu Song said that in consumer electronics, balancing the production line to ensure consistency in capacity and quality has always been a core concern. However, in the field of optical communications and power semiconductors, highly precise requirements dominate. The precision in these two areas goes far beyond the traditional 3C consumer electronics industry. Typically, manufacturing precision for 3C consumer electronics is in the range of 7-10 microns, whereas in the semiconductor field, manufacturing precision requirements are often in the range of 1-3 microns, and even further extended to the sub-micron level. This need for extremely high precision means that the optical communications and power semiconductor industries face unique challenges when it comes to device integration and precision balancing. As a result, advanced manufacturing technologies and process control in these areas have become indispensable key elements to meet the demands of highly precise production and to ensure the highest levels of product quality and performance.

△Microstar Series Automatic High Precision Eutectic Machine   EF8621

Bozhon Semiconductor has made comprehensive and in-depth preparations for the technical characteristics of semiconductor applications, through the full stack of self-research to bring the durability, stability and high precision level of the equipment is the common characteristics of the products displayed at this year's CIOE, the company's display of products, including the Microstar series of fully automated and high-precision die bonder, the Cesistar series of AOI inspection machines, the Faststar series of high-speed and high-precision solid-state machine and the Powerstar series of cleaning machines, of which Powerstar series cleaning machine for product process to enhance the level of reliability and consistency. Yu Song said, Bozhon Semiconductor will cut into the optical communications, power semiconductor market through high-end equipment, optical communications to provide high-precision eutectic welding process equipment, power semiconductors to provide scribing, soldering, sorting and other equipment products, play the company's automation expertise in the field of 3C and the field of new energy batteries, is committed to providing customers with the full range of process solutions.

In optical communication, with the upgrading of AI arithmetic demand, the rate of 800G/1.6T optical module devices is getting higher and higher, and the requirements of large bandwidth, high density and low power devices have brought greater challenges to packaging. Bozhon Semiconductor launched the 800G/1.6T optical module packaging whole line solution in line with the trend, through the COB, BOX, TO CAN and other packaging processes, to create a process that includes the integration of SMD, bonding, optical coupling, aging test and other processes, the whole process automation, production digitalisation. The main product representative of optical communication is Microstar series eutectic machine, which is a high precision and high efficiency multifunctional chip placement equipment. Eutectic placement efficiency can reach 15~35s/pcs, placement accuracy ±0.5~±3μm, with eutectic placement, dipping placement and Flip Chip placement functions, which can meet the needs of multi-chip placement. Suitable for 5G and data communication, lasers, power semiconductors, MEMS, sensors, RF devices and other products requiring high-precision technology packaging process.

800G optical module market in 2023, a rapid start, the overall industry chain in the full adaptation of high-speed optical module customers of large-scale manufacturing, while each generation of optical module life cycle accompanied by the core demand for cost reductions, including optoelectronic chips, core materials and packaging equipment. Yu Song admitted that the 800G era, foreign similar equipment relying on its development history and accumulation will have a first-mover advantage, but BoZhon and other domestic friends in the automation equipment, high precision, stability, cost-effectiveness and other aspects of rapid development. If each optical module customers are using a large number of foreign identical products, it will be difficult to achieve cost differences between each other, affecting product competitiveness upgrade. Bozhong Semiconductor play a full stack of core technology self-research, full-line lighthouse factory programme, not only in the product process link, but also in the overall workshop production line operation using intelligent control, to help customers reduce process costs and improve consistency. In fact, Bozhong Semiconductor in the recent past has successfully passed the product validation of a foreign cloud data centre giant, a number of high-precision automation equipment will be delivered to the optical communications customers in the near future, which lays a solid foundation for the company's continued expansion in the optical network, optical communications market. The company is committed to helping customers to improve capital utilisation, covering the whole process of automation, flexible articulation upgrades, to achieve a high degree of customisation in order taking, rapid sampling, and the formation of differentiated competitiveness in the era of high-speed optical interconnection.

△Bozhon Semiconductor Team

In the post-Moore era, the application and accelerated popularisation of emerging technologies such as 5G, AI and IoT have put forward higher requirements on chip performance and integration. Bozhon semiconductor equipment with high precision, high speed and high stability can provide packaging solutions for 800G/1.6T optical modules, power semiconductors, laser radar and other fields. In the future, Broad Semiconductor will adhere to the mission of "Go tech！Go core！", continue to promote the development of advanced semiconductor processes and industrial upgrading, and continue to provide cutting-edge products for the industry to meet the evolving market demand.