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Major Milestone | Successful Delivery of Bozhon Semiconductor's 3D AOI Inspection Machine
2023-09-13
On 11th September, the AOI inspection machine IR9821 series of Suzhou Bozhon Semiconductor Co., Ltd. with 3D inspection technology was officially delivered to customers.
With the accelerating pace of intelligent transformation and upgrading of the domestic manufacturing industry as well as the increasing trend of machine substitution for manual labour, the domestic 3D AOI inspection equipment market size is still expanding.
The Cesistar Series AOI inspection machine IR9821 delivered this time is a high-speed and high-precision fully automated visual inspection machine utilising deep learning algorithms and 3D technology to determine the quality of packages for different types and sizes of devices by providing high-performance and fully-automated optical inspection. It is widely used in the R&D and manufacturing of semiconductors, consumer electronics and optics. It can realise the inspection function for BGA, LGA, QFN, QFP and other chip package types to ensure the final package appearance quality and yield improvement.
At present, the Bozhon Semiconductor AOI appearance inspection machine series products have been updated to the third generation, with higher sensitivity to the type of small defects, in the chip particle minimum detection accuracy and deep learning algorithms, such as the performance end and the application category has also been further improved. By combining 3D measurement and deep learning algorithms to achieve rapid classification of defect types and improve package quality inspection.
In the future, Bozhon Semiconductor will continue to grasp market opportunities, accelerate product development in various segments, industrial verification and application, and continuously enrich the company's product matrix to achieve a comprehensive breakthrough in technology and help the localisation of semiconductor equipment.
