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The Opening of the Future | The Delivering Ceremony of BOZHON Semiconductor’s first EH9721 Eutectic die bonder
2023-07-20
July 20th, 2023, the delivering ceremony of BOZHON Semiconductor’s first EH9721 Eutectic Machine was held successfully in BOZHON Precision Technology Park. The chairman of BOZHON Precision Technology Co., Ltd. Shaolin Lu, and the CEO Xinhua Wang, together with executives from various business departments and the general manager of BOZHON Semiconductor Song Yu, and representatives of the project team, attended this ceremony, validating the outstanding result of product development and technological innovation of BOZHON Semiconductor in the field of semiconductor packaging and testing equipment.
At the ceremony, the CEO, Xinhua Wang, gave a congratulatory speech for this delivery, expressed his gratitude firstly to the leading enterprise customers in the field of optoelectronics and optical communication for their trust and support, "This delivering ceremony marks the BOZHON Semiconductor’s great technological and innovative achievements in the field of semiconductor packaging and testing equipment. And at the same time, it verified the excellent delivering capabilities of BOZHON Semiconductor in its commitment to customers.”
Shaolin lv, the chairman of BOZHON Precision Technology Co., Ltd., stated that this project has validated the unremitting efforts and hard work of the whole semiconductor team. During the process, everyone has played an irreplaceable role in the team. He also expressed his hope that everyone would continue to consolidate the foundation of technology in the future and enhance the core competitiveness.
Finally, Song Yu, the general manager of BOZHON Semiconductor, presented a bouquet to the project team, and sincerely thanked all members of the project team for their hard work. At the same time, it is also expected that the semiconductor team will make greater contributions in the future.
The EH9721 Eutectic machine of MicroStar Series delivered this time is a high-end equipment for the field of optical chip packaging. This equipment closely matches the market demand, integrates cuttingedge technology, and has excellent performance, functionality and reliability. It is capable of eutectic patch and dipped patch, and can be applied to various equipment packaging methods such as COC, COB, and COS. It adopts a gantry structure with a nanolevel absolute value double feedback, dynamic and automatic replacement of multisuction nozzles (12), multi transfer stations (8), 2x2"/4x4" gel pack/waffle pack, and automatic loading and unloading methods for magazine buffering, together with the host software with complete functions and easy operation, to meet customers' rapid mass production and high productivity need.
Product Features
Large chip size compatibility: 8 transfer stations (0.15*0.2mm-5*5mm)
Large substrate size compatibility: super large working size (eutectic: 18*22mm; die bonding: 130*200mm)
More complete packaging process: COC/COS/GOLD BOX eutectic process; AOC/COB/LENS die bonding process; Flip Chip process
More complete loading methods: 2pcs 6" Wafer, 8pcs (2*4) Gel-paks, support streamline automatic width adjustment docking and loading and magazine loading system
Large unloading size: 9pcs (3*3) Gel-paks/other custom fixtures, support magazine unloading system
Ultra High Precision
Ultra high accuracy: comprehensive accuracy ±3μm@ 3σ (standard sheet)
Ultra high force control system: pressure control accuracy 10-50g (±2g), 50-300g (±10%)
Automatic calibration algorithm: integrated automatic calibration module, the equipment automatically calibrates the system accuracy, reducing manual intervention
Advanced compensation technology: integrated two-dimensional Table-Mapping compensation to ensure the comprehensive accuracy of the equipment
Ultra High Speed
Gantry structure design: The gantry structure design improves the operating efficiency and product compatibility of each axis
Advanced motion control system: high performance ironless motor & carbon fiber structure design, horizontal axis acceleration 2.5g/2m, gantry axis acceleration 2g/1.5m
High-speed streamline design: variable-speed streamline design saves streamline transportation time
Multi-magazine cache design: reduce the frequency of manual loading and unloading
The delivery of the first EH9721 Eutectic Machine is an important milestone in the development of BOZHON Semiconductor. In the future, we will continue to be committed to technological innovation and excellent service in the semiconductor field, constantly exceed customer expectations, and promote the development of the industry.
