September 6~8, the 24th China International Optoelectronic Expo (CIOE 2023) will be opened in Shenzhen International Convention and Exhibition Centre. At that time, Suzhou Bozhon Semiconductor Co., Ltd. will exhibit the Microstar series - automatic high-precision eutectic machine series products, and sincerely invite you to visit, exchange and business negotiation in Hall 10, Booth 10C70!

Exhibition Name: The 24th China International Optoelectronic Expo CIOE2023

Exhibition time: 6-8 September 2023

Booth No.: Hall 10 # 10C70

Venue: Shenzhen Baoan New International Convention & Exhibition Centre

Part of the exhibition products
Microstar Series Automatic High Precision Eutectic Die Bonder
     Microstar series of eutectic Die Bonder are high precision and high efficiency multifunctional chip placement equipment. Eutectic placement efficiency can reach 15~35s/pcs, placement accuracy ±0.5~±3μm, with eutectic placement, adhesive dipping placement and Flip Chip placement functions, which can meet the needs of multi-chip placement. Modular design concept makes it highly flexible manufacturing capability, equipped with intelligent calibration and data management system, making it capable of process traceability and management.

Microstar Series EF8621

The EF8621 offers flexible and diverse packaging capabilities for advanced packaging. The EF8621 offers flexible and diversified packaging capabilities for advanced packaging. It has both eutectic and glue dipping functions, and can be applied to a variety of packaging processes such as COC, COB, COS, etc. The EF8621 meets customers' rapid mass production and productivity requirements through the automatic loading and unloading of multiple nozzles (12 nozzles), multiple rotary stations (8 nozzles), 2x2"/4x4" gel packs/waffle packs, and cartridge buffer, as well as the fully-functional and easy-to-operate host software. mass production and high production capacity.
Application Fields
     Optical communication, optical modules, lasers, high-precision MEMS, medical and bio-optics, automotive, light-emitting diode power semiconductors, RF, microwave and antenna, sensors.
     Thanks to the continuous progress of the localisation of optical chips, a large number of data centre equipment renewal and the construction of new data centres will continue to help the growth of the optical chip market, and China will become the world's fastest growing region.
     Suzhou Bozhon Semiconductor for the field of optical chip launched from 0.5μm~3μm accuracy of the whole series of high precision solid crystal eutectic chip mounter class equipment, is the optical communication enterprises for the next generation of higher speed rate and higher density of 4-way or 8-way 400G/800G/1.6T mounting process of first choice, and at the same time, can be applied to high-power lasers, LIDAR and other fields.