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Highlight | BOZHON Semiconductor Die Bonder Project Wins the First Prize
2023-07-17
On July 14th, 2023, held by the Management Committee of Jiangsu Wuzhong HighTech Industrial Development Zone and Third Generation of Technological and Innovative Semiconductor Industry Strategy Alliance, and coorganized by Wuzhong Science and Technology Bureau, Wuzhong Industry and Information Bureau, Wuzhong Financial Holding Co., Ltd., the 2023 Third Generation of Semiconductor Devices and Applications Innovation Forum as known as the International Third Generation Semiconductor Devices and Applications Innovation and Entrepreneurship Competition was successfully held in Suzhou, Jiangsu Province. Relying on the existing advantages of the semiconductor ecosystem, the conference discusses the latest development of the thirdgeneration semiconductor industry trends, aiming to promote the process of industrial development by focusingon the high-quality innovation and entrepreneurship projects in this field.
As a semiconductor equipment R&D manufacturer, Suzhou BOZHON Semiconductor Co., Ltd. was invited to attend the conference and won the "First Prize" with its BOZHON Semiconductor Die Bonder project.
Yu Song, Vice President of BOZHON Precision Industry Technology Co., Ltd. & General Manager of BOZHON Semiconductor (left), receiving the award on the stage.
A total of 53 enterprises/projects registered for the Innovation Competition, covering the fields of semiconductor materials, devices, power devices, artificial intelligence, semiconductor equipment, control and test systems, and so on. After the judges’ screening, 16 companies/projects finally advanced to the finals.
The judgement team of the award is composed of domestic famous industrial experts and entrepreneurial mentors in semiconductor industry, and conducts a comprehensive assessment in 6 dimensions: industry, product, technology, competition, team, and operation. The project of BOZHON Semiconductor Die Bonder stands out in the finals with its competitive advantages in the fields of semiconductor packaging and testing applications, technological innovation, and foresight, etc., achieving the first place, which fully highlights the excellent comprehensive strength of BOZHON Semiconductor.
BOZHON Semiconductor Die Bonder is a high-speed and high-precision equipment for multi-chip packaging. With an accuracy of ±10μm@3σ, it can achieve a placement efficiency as high as 7000pcs/h (depending on the process). With its open architecture and modular design, the Die Bonder provides on-demand customization capability with extreme efficiency and capabilities that could handle 12" wafers maximum. It is also compatible with various substrate transfer methods to meet die bond, Flip chip, SiP and other packaging processes. It is mainly applicable to ESD, MOS, and the third-generation semiconductor devices SiC and GaN.
Equipment Functions
?Dispense
The main components of silver glue are epoxy resin, silver powder and a small amount of additives. Epoxy resin and additives play a role in bonding, while the silver powder works for electrical and thermal conductivity.
?Pick up
When picking up a chip, the Ejector Pin lifts the chip from underneath the wafer, making it easy to detach from the tape, while the Pick up head sucks up the chip from above.
?Place
The substrate is transferred to the Die bond table of the Die Bonder, and the platform is heated to 120℃. After dispensing, the Pick up head that has grabbed the chip moves to the top of the substrate and presses the chip onto the dispensed Die flag with a certain pressure.
Equipment Features
?Extreme Precision: a high placement accuracy of ±10μm@3σ
?Multi-function: die bond, Flip Chip, multi-chip packaging multi-function all-in-one machine
?Customizable: modular design, compatible with different categories of development needs
In the future, BOZHON Semiconductor would continue to focus on the field of semiconductor packaging and testing to provide global customers with leading and stable advanced process and testing equipment and to further promote the development and upgrading of the industry's advanced processes.
