On September 13, the three-day 25th China International Optoelectronic Expo (CIOE 2024) ended successfully! In this exhibition, bozhon semiconductor to “ride the wind of AI, help photovoltaic innovation” as the theme, with MicroStar full series of products, the heavyweight new product EH9722 eutectic mounter wonderful debut, all-round display of its technological achievements, the release of the industry development trend of new signals!

All in one | Riding on the momentum of the new product release

Bozhon Semiconductor launched the new MicroStar series EH9722 eutectic die bonder, which attracted many domestic and foreign visitors and inquired about its features.
Bozhon Semiconductor has always been focusing on providing precision placement equipment and solutions, the release of the EH9722 eutectic die bonder provides All in one integrated solution, in order to ensure ± 3um placement accuracy based on the same time can have eutectic, dipping, dispensing, UV curing and other placement processes, widely used in COC/COB/COS/Gold-box placement scenarios, deep cavity placement depth of up to 17mm. The depth of deep-cavity placement can reach 17mm. The self-developed high-definition display process observation system truly realizes real-time monitoring of the whole process and reduces risks. Equipped with intelligent calibration and data software management system, the self-developed eutectic friction process programming system can realize customized friction action, reduce void rate and improve surface wetting conditions. This product fills the gap of multifunctional patch products, further improves the product spectrum, and is more perfectly suited to the needs of patch applications in all scenarios.

Innovation and Empowerment | MicroStar Product Matrix

Bozhon Semiconductor full of MicroStar  series eutectic die bonder is a high precision and high efficiency multi-function chip placement equipment. The modular design concept enables highly flexible manufacturing capability, adheres to the integrated design of hardware and software, and provides multiple standard interfaces with intelligent calibration and platform management of functional modules. In response to the diversity of customers' actual needs, it supports the customization of customer configurations, and comprehensively covers the functions of eutectic placement, adhesive-dipped placement, adhesive-dotted placement and Flip Chip placement, which can be flexibly adapted to a variety of chip placement needs.

In this exhibition, Bozhon semiconductor held the “eutectic machine products future technology development route” theme sharing meeting. For the optical communication field placement application scenarios, Bozhon semiconductor on the development trend of the industry, the development of pain points and Bozhon semiconductor high-precision placement solution innovation advantages were introduced in detail. In this seminar, the innovative technology and advantageous parameters of MicroStar series of eutectic machine products and stringing solutions won wide attention and praise from the audience.

Wonderful | Playing in the exhibition area to get a big gift

In this exhibition, Bozhon Semiconductor has prepared interactive games while bringing you technical experience and visual feast. Visitors can win Bozhon Semiconductor's exquisite gifts through cell phone code scanning, shaking and other forms. The activities in the exhibition area were exciting and the popularity continued to rise.

At the same time, the Bozhon Semiconductor booth focused on the high attention of the industry's various authoritative media, captured the show's exciting moments and highlights through a specialized perspective, but also in-depth exchanges with industry experts, and jointly excavate the technological path of optoelectronic packaging and market dynamics.

As the curtain falls on the optoelectronics feast, the road of exploration continues to move forward! Looking ahead, Bozhon Semiconductor will continue to accelerate the pace of innovation, create outstanding products, and work with global partners to promote the development of the optoelectronics industry.