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Successful Debut | Bozhon Semiconductor's First Overseas Exhibition in 2024 Successfully Completed
2024-03-09
APE2024
In the spring breeze, the three-day Asia Photonics Expo 2024 (APE 2024) concluded successfully on March 8 in Singapore. Asia Photonics Expo, organized by Informa Markets (Informa Group), focuses on the latest cutting-edge innovative technologies and emerging application markets in Asia's photonics industry, and provides innovative technologies and comprehensive solutions for nine major application areas, including optical communications, information processing and storage, consumer electronics, advanced manufacturing, surveillance/security, semiconductor processing, energy, sensing and test & measurement, lighting and display, and healthcare.
As a semiconductor process equipment manufacturer, Bozhon Semiconductor, with the theme of "Riding the wave of AI, empower the innovation of optoelectronics". Bozhon Semiconductor brought 800G/1.6T optical module packaging solutions, laser chip packaging solutions and power semiconductor digital factory solutions to the show, which attracted the attention of many guests.
Innovative Technology Sneak Peek
During the exhibition, Bozhon Semiconductor delivered a keynote speech on chip packaging in the field of optical modules in the concurrent forum "SELECTED SOURCING CONNECT". Attendees were given an insight into the structure of the optoelectronics industry and the needs of customers, as well as a presentation on the customization of equipment and precise and efficient total solutions for the packaging of optical modules.
The arrival of the AI big computing power era has promoted the upgrading of optical communication technology, making high speed rate, integration, and large capacity become the core demand of optical chips. The packaging process of the optical module has more links, which is different from the common semiconductor chip packaging, especially in the patch, wire, lens coupling, etc. There are certain technical barriers, and the advantages and disadvantages of the process directly affect the yield or performance of the product.
BOZHON Optical Module Field Placement Equipment
Bozhon Semiconductor MicroStar series EH9721 Eutectic Mounter is the ideal tool for 400G/800G optical module product placement. It integrates high-precision, high-efficiency and multi-functional chip placement functions, with eutectic placement efficiency up to 15~35s/pcs, placement accuracy ±3μm@3σ, force control accuracy 10~300g±3%, and both eutectic placement, adhesive-dipped placement and Flip Chip placement functions, which can satisfy multi-chip and multi-process placement scenarios. By adopting nanometer absolute value double feedback gantry structure, multiple nozzles (12) dynamic automatic replacement, multiple transit stations (8), 2x2"/4x4" gel pack/waffle pack, and cartridge cache automatic loading/unloading method, and cooperating with full-featured and easy-to-operate uploading and unloading software, it can satisfy the customer's demand for rapid mass production and high productivity.
Although this is the first overseas exhibition for Bozhong Semiconductor, the company's equipment has already taken the lead in entering the overseas market. Relying on the globalization layout of its group company, Bozhong Precision, Bozhong Semiconductor has gradually emerged in the overseas market by virtue of its core advantages of innovative technology, high-end products and customized services, making it one of the few Chinese brands in the semiconductor field capable of exporting its equipment to overseas developed countries.
In the future, Bozhon Semiconductor will continue to strengthen the exploration and practice of international development, and provide leading and stable advanced process equipment for global customers.
