As a very large-scale and influential photovoltaic industry event

The 24th China International Optoelectronic Expo

2023 CIOE was successfully held from 6 to 8 September.

For the global optoelectronic industry to bring a

feast of scientific and technological innovation

Bozhon Semiconductor is proud to present

800G/1.6T Super Computing Power to Explore the Future of AI

as the theme of the exhibition

Successfully appeared in Booth 10C70

Attracted many professional visitors

The scene is very lively

Focus on Packaging Industry Coverage

At this exhibition

Bozhon Semiconductor highlights

Two core theme solution innovations

800G/1.6T Optical Module Packaging Line Solution

Aiming at the demand for AI computing power

The rate of 800G/1.6T optical module devices is getting higher and higher.

Large bandwidth, high density, low power device requirements

Bringing greater challenges to packaging

Bozhon Semiconductor

Through COB, BOX, TO CAN and other packaging processes

To create a package that includes SMD, bonding, optical coupling, aging test and other

Process integration, whole process automation, digital production

Optical module packaging line solution

Power Semiconductor Digital Factory Turnkey Solutions

IGBT as a key power semiconductor device

In new energy vehicles, wind power storage, industrial control and other fields

There are a wide range of applications

Bozhong Semiconductor combines the automation and digitalisation of production lines

The use of a large number of advanced information technology means

Realise the seamless connection between the data flow in each management system.

Completed sorting, placement, side frame assembly, key line,

Filling and curing, testing and other processes

Debut Exhibition Exhibits Gathering

Microstar Series EF8621

Fully automatic high-precision eutectic machine model

Debut at the exhibition

High precision of ±0.5~3μm

Patented eutectic table with bionic design

High precision pick & place system

Efficient eutectic heating system and wafer feeding system

All reach the international advanced level

Microstar Series Automatic High Precision Die Bonder

Microstar series of eutectic machines are high precision and high efficiency multi-functional chip placement equipment. Eutectic placement efficiency can reach 15~35s/pcs, placement accuracy ±0.5~±3μm, with eutectic placement, adhesive dipping and Flip Chip placement functions, which can meet the needs of multi-chip placement. Suitable for 5G and data communication, lasers, power semiconductors, MEMS, sensors, RF devices and other products that require high-precision technology packaging process.

Cesistar Series AOI Inspection Machine

AOI inspection machine is a high-speed and high-precision fully automatic visual inspection equipment using optical principle to detect chip defects, mainly used in chip package development and manufacturing. For BGA, LGA, QFN, QFP and other packages, it provides comprehensive 6-side inspection and 2D/3D measurement.

Faststar Series High Speed and High Precision Die Bonder

The FastStar Series is a series of high-speed and high-precision Die Attach Equipments designed for multi-chip packaging. With our self-developed motion control technology,and are compatible with various substrate transport methods, meeting packaging processes such as die attach,   Flip chip, SiP, etc.

PowerStar Series Wafer Cleaning System

PowerStar Series is widely used in the field of integrated circuits and advanced
packaging for photoresist removal processes. With a high degree of automation
and an adoption of modular design, this series can be customized based on
customer needs from its design and development, machine assembly, testing, and
equipment installation to after-sales service.

Media Interaction and Dialogue for the Future

During the exhibition

Yu Song, Vice President of Bozhong Precision Industry and General Manager of Bozhon Semiconductor

Accepted the magnesium guest network, Xunshi network, optical fibre online and other

Several media interviews

He put forward the post-Moore era

The application and accelerated popularity of emerging technologies such as 5G, artificial intelligence and Internet of Things (IoT)

Higher requirements on chip performance, integration, etc.

Bozhon semiconductor equipment

Features high precision, high speed and high stability

800G/1.6T optical modules, power semiconductors, laser radar and other fields

Provide packaging solutions

BOZEMI博众半导体

，赞3

The Future

Boxer Semiconductor will continue to

"GO TECH! GO CORE"

Promote the development of advanced semiconductor processes and industrial upgrading

Provide cutting-edge products for the industry