Packaging technology is one of the key steps in semiconductor manufacturing and involves connecting the chip to external circuitry and providing protection and heat dissipation. Packaging is a multi-layered, complex process whose goal is to enable the chip to function properly under a variety of environmental conditions. Since the 1990s packaging technology has evolved from conventional packaging to advanced packaging. At this stage, packaging technology is represented by ball grid array packaging (BGA), wafer level packaging (WLP), chip scale packaging (CSP), and wafer chip level packaging (WLCSP). The packaging technologies since then are collectively referred to as advanced packaging technologies.

What is Advanced Packaging?

Advanced packaging (Chiplet) technology is a method of dividing chip functionality into a number of separate chip modules or small pieces. Each Chiplet module has a specific function, and these modules communicate and collaborate with each other through high-speed connections. This modular design concept allows multiple vendors to independently design and produce their own modules, and finally integrate them to achieve a highly customised and expandable processor solution. In addition, advanced packaging, also known as high-density advanced packaging (HDAP), is a package that employs advanced design thinking and advanced integration processes, shortens lead interconnect lengths, reconfigures the chip for system-level packaging, and effectively improves the density of system functionality.

Trends in Advanced Packaging

As chip functions and performance continue to improve, the demand for advanced packaging is also increasing. The market share of advanced packaging is already very high in certain segments such as high-performance computing, artificial intelligence, and the Internet of Things.

According to Yole Intelligence, advanced packaging will surpass traditional packaging in terms of revenue by 2025. At the same time, it said that the main application areas of advanced packaging are currently focused on consumer electronics, but the growth rate of the technology's application in the telecoms infrastructure and automotive electronics will accelerate significantly in the future. In terms of its internal technology, the segments with the highest growth rates are expected to be embedded wafers, 2.5D/3D, and flip chips. This indicates that the advanced packaging market has enormous potential and room for growth.

Advanced packaging technologies at this stage include FlipChip, Wafer Level Packaging (WLP), 2.5D Packaging (Interposer, RDL), 3D Packaging (TSV) and so on.

FlipChip is a kind of packaging method in which the chip is inverted on the substrate and the connection between the chip and the substrate is realised through bumps. With the continuous improvement of chip functions and performance, the application of FlipChip is becoming more and more widespread. In the future, flip-chip soldering will continue to maintain its dominant position and develop in the direction of more high-speed, more reliable and more miniaturised.

Wafer Level Packaging (WLP) is a packaging method that integrates multiple chips into a single package, allowing for high-density, high-performance packaging. As the market demand for high-performance computing and memory and other products continue to increase, the application of wafer-level packaging will become more and more widespread. In the future, wafer-level packaging will continue to move towards more high-speed, more reliable, more miniaturised direction.

2.5D packaging (Interposer, RDL) is a packaging method that realises the connection between chip and chip through the intermediary layer, which can achieve high-density and high-performance packaging. As the market demand for products such as high-performance computing and memory continues to increase, the application of 2.5D packaging will become more and more widespread. In the future, 2.5D packages will continue to develop in the direction of higher speed, reliability and miniaturisation.

3D packaging (TSV) is a packaging method that vertically stacks multiple chips together and achieves chip-to-chip connectivity through TSV and other means. As the market demand for products such as high-performance computing and memory continues to increase, the application of 3D packaging will become more and more widespread. In the future, 3D packaging will continue to develop in the direction of higher speed, reliability and miniaturisation.

Encapsulation process key equipment solid crystal machine

Benefiting from the trend development of advanced packaging chiplet industry, the back-channel packaging equipment industry is also further broadened. The solid crystal machine is the packaging process accounted for a high proportion of equipment, in the advanced packaging manufacturing plays an important role. In the advanced encapsulation process, the solid crystal machine will chip from the wafer has been cut to grab down, and placed in the substrate corresponding to the Die flag, the use of silver glue (Epoxy) or tin paste and other materials to the chip and the substrate bonding up.

Solid crystal bonder has the characteristics of high precision and high speed, and can achieve automation and large-scale production. In advanced packaging manufacturing, the solid crystal machine is one of the key equipments to achieve precise alignment and firm bonding between the chip and the substrate. With the rapid development of advanced packaging technology, the solid crystal bonder needs to have more accurate positioning, more stable motion control, and more powerful adhesion system in order to meet the precise and reliable execution requirements of the advanced packaging process.

Bozhon Semiconductor developed MicroStar series of automatic high-precision die bonding machine and FastStar series of high-speed, high-precision die bonder are perfectly suited to the advanced packaging process. StarWay series automatic high-precision eutectic mounter can reach ±0.5-3μm placement accuracy, angular accuracy of ±0.1 °, with eutectic mounter, dipping mounter and Flip Chip mounter function, to meet the needs of multi-chip placement. The uniquely designed horizontal turret placement head of Bozhon eutectic machine can carry 12 different nozzle tools at the same time, and can achieve automatic switching of nozzles to minimise the changeover time between different materials, processes and products. The modular design concept allows for highly flexible manufacturing capabilities, flexible process platforms, programmable configuration of process applications, and support for multiple process flows.

The precision and speed of the solid crystal machine will directly affect the efficiency and quality of the whole package manufacturing process, and directly affect the production capacity and chip sealing yield and cost. Different packaging processes and materials will put forward different requirements for the performance of the solid crystal machine, so the solid crystal machine will need to have a higher degree of configurability and adaptability. In the future, high precision, high efficiency, diversification, customisation, intelligence, environmental protection and sustainable development is the inevitable trend of the development of the solid crystal machine, let us look forward to the solid crystal machine in the future for the development of advanced packaging technology to bring more innovation and breakthroughs!