Today's manufacturing industry is facing tremendous challenges and opportunities. In this competitive environment, improving productivity and product quality is a top priority for every manufacturer. Automated Optical Inspection (AOI) inspection machines play a key role in this regard, leading to a revolutionary change in manufacturing.
AOI (Automated Optical Inspection) is a device that uses optical technology for image analysis to detect product defects. It has a wide range of applications in various manufacturing fields, from electronics manufacturing to semiconductors, to medical device manufacturing and the automotive industry. As technology continues to evolve, AOI systems are becoming smarter and more efficient. They are able to respond to changing manufacturing requirements and support more complex inspection tasks. In addition, AOI systems are increasingly integrated with industrial automation and IoT technologies, providing more data and analytics options to further improve the visualisation and control of production processes.

Application of AOI inspection machine in semiconductor field

In the semiconductor field, AOI chip appearance defect inspection equipment is mainly used to detect the appearance problems of chips.

1. Missing and damaged components: AOI equipment can detect whether there are missing components or whether the components are damaged on the chip, such as resistors, capacitors, transistors and so on.

2. Soldering quality problems: They can detect the quality of soldering connections, including poor contact at soldering points, false soldering, solder overflow and other problems.

3. Cracks and breaks: AOI systems are able to identify cracks, breaks or splits on the chip that could lead to chip fragility.

4. foreign objects and impurities: These devices can detect foreign objects, dust or impurities on the chip that may interfere with the normal operation of the chip.

5. component offset and misalignment: they can detect whether the components are correctly mounted and positioned to ensure that the components are in their intended locations.

6. lead and wire problems: AOI systems can detect lead and wire problems such as broken, misaligned or damaged wires.

7. Coating issues: They can detect coating uniformity and integrity to ensure that the protective coating of the chip is effective.

8. Marking issues: AOI devices can detect whether markings and labelling are correct and clearly visible for tracking and identification of the chip.

9. Surface quality: They are also capable of detecting the quality of the chip surface such as scratches, abrasions, stains, etc., which may affect the reliability and performance of the chip.

10. Package Problems: AOI systems are also capable of detecting package problems such as package cracks, incomplete packages, etc., which may cause damage to the chip in use.

Automated Optical Inspection (AOI) inspection machines play a vital role in the production of chips by ensuring that the appearance and quality of the chip meets the expected standards, thus improving the reliability and performance of the chip, and reducing the defective rate and cost in production.

From 2D to 3D AOI: A Visual Revolution in Electronics Manufacturing
In the field of AOI, 2D AOI and 3D AOI are two common technologies. 2D AOI focuses on inspection of flat images via a camera and is suitable for surface inspection and solder joint inspection. However, as manufacturing requirements continue to increase, the use of 3D AOI technology is growing. 3D AOI uses lasers or projected light and a camera to acquire three-dimensional information about an object, and is suitable for more complex inspections, such as component offsets, solder heights, etc. 3D AOIs are often more suited to applications that require high-precision inspections, and while they may be more costly, they provide manufacturers with a more comprehensive inspection solutions.
The introduction of 3D AOI technology has sparked a visual revolution in electronics manufacturing. This technology not only improves the accuracy of inspection, but also enables the detection of more types of defects, such as soldering issues and component shifts. 3D AOI also supports more complex component layouts and advanced packaging technologies, giving electronics manufacturing greater freedom in design and production.

Bozhon Semiconductor Cesistar series AOI inspection machine
Bozhon Cesistar series chip appearance inspection AOI equipment can support a variety of package forms, corresponding to a variety of package size, the use of 2D + 3D combination of optical algorithms mode, the product top + bottom + side side side of the full range of 6-side inspection, in order to ensure the quality of the final package appearance.

Two major algorithms guarantee
1、No shadow 3D measurement technology: using 4 Projector system, multi-angle 3D reconstruction, to achieve no shadow blocking; integrated 2D + 3D detection, can be a large field of view of high-precision Bottom 3D detection.

2、intelligent detection algorithms: AI intelligent defect classification algorithms; modular algorithm library, simple configuration; for discolouration, copper exposure for high-precision colour detection; high stability of the equipment, cross-machine can be shared Job

As technology continues to evolve and innovate, the capabilities and performance of Automated Optical Inspection (AOI) inspection machines will continue to enhance, opening up more possibilities for the future of manufacturing. And continue to create value for the global manufacturing industry.