SMD machine is an indispensable equipment in the semiconductor packaging process, it can realize high-speed, high precision fully automatic chip placement, through the use of high-precision positioning and control system, the chip will be pasted on the substrate.
Solid crystal patch generally contains eutectic, dipping, dispensing and other mounting processes (solid crystal patch process can generally be divided into eutectic, dipping, dispensing, etc.), through high-frequency heating to make the adhesive curing, so that the chip and the lead frame to combine solidly, so as to ensure the reliability and stability of the package. Among them, the chip dispensing process according to the different needs of the process, crystalline adhesive can generally be divided into insulating adhesive, thermally conductive white glue and conductive silver adhesive three categories, of which insulating adhesive is the most widely used; according to the different material systems can be divided into epoxy crystalline adhesive and silicone crystalline adhesive two major categories, epoxy crystalline adhesive adhesive bonding force, but poor heat resistance, easy to yellowing, light decay is serious, can only be used for low-power low-end products; and silicone crystalline adhesive Temperature resistance and weather resistance, not easy to yellow, wider range of application, electronic products chip dispensing processing sealing work most of the application of epoxy resin glue or UV glue glue sealing work, these glues are widely used in integrated circuits, microelectronics, semiconductors and other chip packaging field.

UV adhesive & epoxy resin adhesive characteristics
UV adhesive is a kind of adhesive that needs to be cured by ultraviolet light irradiation, which has the characteristics of high light transmittance, high bonding strength and strong weather resistance, and can be applied to various chip packages. Epoxy resin (EPOXY) adhesive is a polymer material, refers to the molecule contains two or more epoxy groups in the organic compounds, with high adhesive strength, high temperature resistance, corrosion resistance, low shrinkage rate and other characteristics, commonly used in chip packaging.
However, whether it is UV adhesive or epoxy adhesive, its curing time and bonding effect will be affected by the ambient temperature. Therefore, in order to ensure the stability and reliability of the package, chip lamination, glue materials need to meet the requirements:
1. good match with the chip surface, to provide sufficient bonding area
2. has a high viscosity, can form a stable bond in the chip tiny metal contact points
3. good processing performance, easy to coat, curing, cutting and assembly.

What is epoxy chip placement?
Epoxy chip bonding is an electronic component packaging technique commonly used in the manufacture of integrated circuits (ICs) and other electronic components. When using epoxy for the chip bonding process, a very small amount of epoxy is typically placed precisely on the substrate and the chip is then placed on the substrate. The epoxy is then hardened by reflow or curing at temperatures ranging from 150°C to 250°C to bond the chip to the substrate.

△ Functional diagram of epoxy molding compound

Epoxy Resin Patch Application Fields
Epoxy resin material has the characteristics of light weight, low cost, easy to scale production, both high strength, corrosion resistance and insulation properties, in the electronic and electrical materials have been widely used. Epoxy patch process is applicable to a variety of different types of electronic equipment manufacturing.
1. Integrated circuits (IC) manufacturing: epoxy patch process is widely used in the manufacture of various types of integrated circuit chips, including microprocessors, memory chips, sensor chips, etc..
2. Electronic circuit board manufacturing: PCB (Printed Circuit Board) usually need epoxy patch to install and connect various electronic components, including surface mounted components (SMD) and plug-in components.
3. Communication equipment: cell phones, routers, switches and other communication equipment in a variety of electronic components are usually assembled through the epoxy patch process.
4. Consumer electronics: TVs, stereos, cameras, game consoles and other consumer electronics use the epoxy SMD process to integrate various electronic components.
5. Automotive electronics: Epoxy SMD process is used to manufacture electronic components such as control units, sensors and entertainment systems in automobiles.
6. Medical equipment: Electronic components in medical equipment, such as cardiac monitors, medical imaging equipment, etc., are also assembled using the epoxy SMD process.
7. Industrial control systems: Various controllers and sensors in industrial automation and control systems often require epoxy patching.
8. Aerospace equipment: Navigation systems, communication equipment and sensors in the aerospace field also use the epoxy patch process.

△Brief process flow diagram of epoxy sealer molding compounds

For the market often referred to as "epoxy mounter", Bozhon Semiconductor has launched the FastStar series of solid state machine is a high-speed, high-precision equipment for multi-chip packaging, accuracy of up to ± 7μm @ 3σ, open architecture and modular design to provide the ultimate efficiency of on-demand customization capabilities, the maximum handling of 12-inch wafers, compatible with a variety of substrate transfer methods, to meet the solid state, MCM, Flip chip, SiP and other packaging processes. Compatible with a variety of substrate transfer methods, to meet the solid crystal, MCM, Flip chip, SiP and other packaging processes. Wide range of application industries: consumer electronics, automotive, display panels, new energy and so on.

Through the previous introduction, I believe you have a better understanding of epoxy resin patch. As a powerful material, epoxy resin patch plays an important role in many fields, I hope this article can help you better recognize and understand epoxy resin patch.