On 11th September, the AOI inspection machine IR9821 series of Suzhou Bozhon Semiconductor Co., Ltd. with 3D inspection technology was officially delivered to customers.
Currently, China's 2D AOI inspection equipment has achieved a very high localisation rate, however, in the field of 3D AOI inspection, the localisation rate is roughly only 10%-20%. The delivery of this product marks a milestone in the technological breakthrough of Bozhong's semiconductor AOI inspection equipment, and at the same time, it is also a major breakthrough in China's semiconductor back-channel 3D AOI inspection equipment industry.
With the accelerating pace of intelligent transformation and upgrading of the domestic manufacturing industry as well as the increasing trend of machine substitution for manual labour, the domestic 3D AOI inspection equipment market size is still expanding.
△ China AOI inspection equipment market size (billion yuan)Cesistar Series AOI Inspection Machine
The Cesistar Series AOI inspection machine IR9821 delivered this time is a high-speed and high-precision fully automated visual inspection machine utilising deep learning algorithms and 3D technology to determine the quality of packages for different types and sizes of devices by providing high-performance and fully-automated optical inspection. It is widely used in the R&D and manufacturing of semiconductors, consumer electronics and optics. It can realise the inspection function for BGA, LGA, QFN, QFP and other chip package types to ensure the final package appearance quality and yield improvement.
At present, the Bozhon Semiconductor AOI appearance inspection machine series products have been updated to the third generation, with higher sensitivity to the type of small defects, in the chip particle minimum detection accuracy and deep learning algorithms, such as the performance end and the application category has also been further improved. By combining 3D measurement and deep learning algorithms to achieve rapid classification of defect types and improve package quality inspection.
In the future, Bozhon Semiconductor will continue to grasp market opportunities, accelerate product development in various segments, industrial verification and application, and continuously enrich the company's product matrix to achieve a comprehensive breakthrough in technology and help the localisation of semiconductor equipment.