BOZHON has been dedicated to the field of industrial equipment manufacturing for nearly 20 years. This exhibition showcases multiple products and showcases semiconductor equipment localization solutions to guests.

BOZHON Semiconductor focuses on the research and development, production, and sales of cleaning, testing, and measurement equipment for semiconductor wafers and packaging products. The fully automatic high-precision crystal solidification machine independently developed by the BOZHON R&D Center on display at this exhibition combines eutectic patches, adhesive patches, and Flip chip functions, with a bonding accuracy of plus or minus 3 microns. It can be applied in various fields such as CoC, CoB, Gold Box, and so on.

As a highly flexible and cost-effective automation equipment, it can achieve the optimal high-precision crystal solidification solution, attracting the attention of guests from both inside and outside the industry. Customers visiting and communicating at the booth are endless.

AOI detection equipment was also launched at the same time, providing high-performance and highly stable fully automatic optical detection for IC packaging. Suitable for appearance defect detection and 3D measurement of products such as BGA, LGA, QFN, CSP, QFP, TSSOP, WLP, etc. It has the advantages of wide detection size range, high detection accuracy, and complete types of defects detected. At the same time, it adopts a combination of traditional image processing and artificial intelligence deep learning to achieve accurate detection and intelligent classification of defect types.

At the same time, BOZHON also acts as an agent for the single crystal wafer cleaning machine and image overlay equipment developed by Korean manufacturers for wafer production and manufacturing, providing diversified choices for the market.

At the logistics automation end,BOZHON also provides AGV unmanned transport vehicles for automatic three-dimensional handling and storage of wafers/cartridges in high cleanliness environments. Widely used in wafer/magazine usage and storage stations in semiconductor wafer and packaging factories, suitable for FOUP, FOSB, CASSETTE,Various vehicles, etc.

As is well known, most semiconductor equipment manufacturers in the current market are foreign manufacturers, and there is a lack of long-term large-scale use opportunities for similar equipment in China. BOZHON Semiconductor has entered this field and utilized its own technological advantages to provide customers with more options. In the future, BOZHON will continue to improve its own technology, invest greater efforts in research and innovation, and further expand its semiconductor business with high-quality and efficient products, solutions, and services, to maximize customer value and contribute to the vigorous development of China's equipment manufacturing industry.