From February 26th to 28th, the Asia Photonics Expo (APE) 2025 was grandly held in Singapore. As one of the most influential exhibitions in the optoelectronics industry in Asia, APE focuses on cutting - edge innovative technologies and emerging application markets in fields such as optical communication, precision optics, lasers, infrared, intelligent sensing, quantum, and new displays. It provides a platform for optoelectronics enterprises in Asia and even around the world to showcase the latest technologies, exchange industry trends, and expand cooperation opportunities.

At the beginning of the new year, Bozhon Semiconductor made its overseas debut. Under the theme of "Innovating the Future of Semiconductors and Empowering Optoelectronic Packaging in the AI Computing Power Era", it showcased the newly - upgraded  MicroStar  EF8622 eutectic die bonder and solutions for optoelectronic chip mounting, demonstrating to the world the innovative strength of Chinese intelligent manufacturing.

During the exhibition, the innovative product technologies at Bozhon Semiconductor's booth attracted the attention of many overseas audiences, customers, and industry experts. There was a continuous stream of visitors coming to inquire and negotiate, and the booth was bustling with activity.

With the rapid penetration of information technologies such as cloud computing, the Internet of Things, and artificial intelligence, the global demand for high-speed optical modules has been continuously increasing. According to LightCounting's prediction, the global optical module market size will reach 11.3 billion US dollars in 2025, with a compound annual growth rate of 11% from 2021 to 2025. Among them, the global data center optical module market is expected to reach 7.33 billion US dollars in 2025, with a compound annual growth rate of 14% from 2021 to 2025.

Southeast Asia, as an important growth pole of the global optoelectronics industry, has a rapidly developing digital economy, intelligent manufacturing, and communication infrastructure, which provide broad application scenarios for optoelectronic technologies. According to incomplete statistics of the ICC, nearly 80 optical communication enterprises of different scales have successively built factories or offices in Southeast Asia.

Guided by customer needs, Bozhon Semiconductor continues to deepen its internationalization strategy and actively arranges its layout in the overseas market. Relying on its strong R&D capabilities, rich product portfolio, and diversified business models, it has gained experience in equipment delivery in multiple countries and regions, including the United States and Thailand. Moreover, it has established close cooperative relationships with local partners and continuously improves product quality and after-sales service.

                                    Packaging and die bonding equipment. Innovative technologies lead the industry trend.

Bozhon Semiconductor's Starway full series of products has accumulated rich understanding of customer scenarios in fields such as optical modules, lasers, and microwave radio frequency. At this exhibition, Bozhon Semiconductor focused on showcasing the MicroStar series EF8622 eutectic die bonder equipment. As an upgraded version of the EF8621, this equipment not only continues the characteristics of high precision and high reliability of the equipment but also achieves significant improvement in multi-functional compatibility. It supports various die bonding processes such as COC, COS, GOLD BOX, and Flip Chip. Through the optimization of the programmable pulse heating algorithm, the equipment can precisely control the temperature during the eutectic process to ensure that there is no overshoot of the surface temperature. In addition, while retaining the dual-station design of the mechanical structure, a streamlined design has been newly added, which can seamlessly interface with the AGV automatic loading and unloading system, greatly improving production efficiency and achieving data interconnection of the material production line.

Through this exhibition, Bozhon Semiconductor not only showcased its latest technological achievements in the optoelectronics field but also further enhanced its brand influence and popularity in the overseas market. In the future, Bozhon Semiconductor will continue to deeply cultivate the Southeast Asian market. Driven by innovation and guaranteed by quality, it will accelerate its global layout, continuously provide high-quality die bonding solutions, and work hand in hand with its partners to jointly open a new chapter of an opto-connected future.